In a coil component, a shield layer is provided after the unevenness of the surface of an element body is smoothened by the surface being covered with an insulating layer. A Cu layer of the shield layer is provided on a smooth surface, and thus a thickness variation can be suppressed and the Cu layer can be formed with a substantially uniform thickness. In the coil component, a point where the shield layer is thin or a point lacking the shield layer is unlikely to be generated and a functional degradation of the shield layer is effectively suppressed.

According to one embodiment, a semiconductor device 1 includes an Si substrate 11, an inductor 12 formed in wiring layers disposed above the Si substrate 11, and a shield 13 formed so as to surround the inductor 12, in which the shield 13 includes metals 105 to 109 formed in, among the wiring layers, a layer in which the inductor 12 is formed and a layer above that layer, and a silicide 104 formed between the Si substrate 11 and the wiring layers above the Si substrate 11.

To inhibit a decrease in inductance of an inductor in a plurality of semiconductor chips that are stacked. A semiconductor device includes: first and second semiconductor chips that are stacked; a first inductor; an arrangement-restricted region; and a circuit. In the semiconductor device, the first inductor is arranged in the first semiconductor chip. The arrangement-restricted region is provided in a region of the second semiconductor chip corresponding to the first inductor. The circuit is arranged in a region of the second semiconductor chip not corresponding to the arrangement-restricted region.

A multi-phase buck switching converter having grouped pairs of phases, each phase using two magnetically coupled air-core inductors. For each group, a first driver circuit controlling switching of a first power transistor switching circuit coupled to a first air-core inductor output for driving an output load at the first phase. A second driver circuit controlling switching of a second power transistor switching circuit coupled to a second air-core inductor output for driving said output load at the second phase. The first and second phases are spaced 180 apart. The coupled air-core inductors per group of such orientation, separation distance and mutual inductance polarity relative to each other such that magnetic coupling between the two or more inductors at each phase results in a net increase in effective inductance per unit volume. Each air-core inductor is a metal slab of defined length, height and thickness formed using back-end-of-line semiconductor manufacturing process.

A coil component includes a body having one surface and another surface opposing each other in one direction, a plurality of walls each connecting the one surface to the other surface, and a coil portion disposed therein. A recess extends along at least portions of edges common to the one surface and to walls of the plurality of walls. A lower insulating layer is disposed in the recess and on the one surface. First and second external electrodes penetrate through the lower insulating layer, are spaced apart from each other on the one surface of the body, and are connected to the coil portion. A shielding layer is disposed on the other surface of the body and the plurality of walls of the body, and extends to the one surface of the body to be spaced apart from the first and second external electrodes.

An electronic component includes a main body, an inner conductor inside the main body, one or more outer electrodes on a bottom surface of the main body and not provided on four side surfaces of the main body, and a shield electrode covering the four side surfaces of the main body and having a cylindrical or substantially cylindrical shape, the shield electrode not being physically connected to any of the one or more outer electrodes at a surface of the main body and being connected to the inner conductor at a surface of the main body.

A surface mount inductor includes a coil buried in a composite material including a magnetic powder; outer terminals connected to the coil; and a molded body having a metal surface that intersects a winding axis of the coil and including the composite material. A surface mount inductor manufacturing method includes arranging, inside a mold, a metal plate having a shape covering part of a surface of a molded body; arranging a coil and a composite material including a magnetic powder or a preliminary molded body composed of the composite material inside the mold in which the metal plate has been arranged; and forming a molded body in which the coil is buried and that has the metal plate arranged on part of a surface of the molded body by molding the metal plate, the composite material, and the coil inside the mold to be integrated with each other.

An EMI magnetic bead inductor comprises a magnetic core and at least one metal pin group. The metal pin group includes at least one first metal pin. The first metal pin has two first inserting portions and one first connecting portion. First ends of the two first inserting portions are connected by the first connecting portion. The magnetic core is provided with a plurality of insertion holes. Second ends of the two first inserting portions are inserted into two said insertion holes from first ends of the two said insertion holes and protrude from second ends of the two said insertion holes.

Provided is a stacked electronic component having: a stacked body 1 in which ceramic layers 1a to 1h are stacked, the stacked body having an a upper surface U and side surfaces S; at least one recess portion 8 formed on the upper surface U that indicates at least one of a mark, a letter, or a number; electrodes 3, 4, 5, 6 formed between the layers of the stacked body 1; and a shield layer 9 formed on the upper surface U and the side surfaces S of the stacked body 1. Right below an inner bottom surface of the recess portion 8 of the stacked body 1, there is provided a no-electrode region NE in which the electrodes 3, 4, 5, 6 are not formed, the no-electrode region NE having a thickness which is equal to or larger than a depth of the recess portion 8.

A coil component includes a body including a magnetic metal powder, and a coil portion in the body. First and second external electrodes are disposed on one surface of the body and connected to the coil portion, and a third external electrode includes a pad portion disposed on the one surface of the body and a side surface portion disposed on at least one side surface of the body. An insulating layer covers surfaces of the body other than the one surface and has an opening exposing the side surface portion of the third external electrode. A shielding layer is disposed on the insulating layer and is connected to the side surface portion of the third external electrode through the opening.