H01F2017/008

STACKED SPIRAL INDUCTOR
20200005980 · 2020-01-02 · ·

A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a conductive coil in a shape of a spiral and a through hole area used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer.

Fully integrated multi-phase buck converter with coupled air core inductors

A multi-phase buck switching converter having grouped pairs of phases, each phase using two magnetically coupled air-core inductors. For each group, a first driver circuit controlling switching of a first power transistor switching circuit coupled to a first air-core inductor output for driving an output load at the first phase. A second driver circuit controlling switching of a second power transistor switching circuit coupled to a second air-core inductor output for driving said output load at the second phase. The first and second phases are spaced 180 apart. The coupled air-core inductors per group of such orientation, separation distance and mutual inductance polarity relative to each other such that magnetic coupling between the two or more inductors at each phase results in a net increase in effective inductance per unit volume. Each air-core inductor is a metal slab of defined length, height and thickness formed using back-end-of-line semiconductor manufacturing process.

Coil component

In a coil component, a shield layer is provided after the unevenness of the surface of an element body is smoothened by the surface being covered with an insulating layer. A Cu layer of the shield layer is provided on a smooth surface, and thus a thickness variation can be suppressed and the Cu layer can be formed with a substantially uniform thickness. In the coil component, a point where the shield layer is thin or a point lacking the shield layer is unlikely to be generated and a functional degradation of the shield layer is effectively suppressed.

High-Q Integrated Inductor and Method Thereof
20190333672 · 2019-10-31 ·

A device having a substrate, a dielectric slab attached upon the substrate, a coil including a plurality of metal segments laid out on a first metal layer secured by the dielectric slab, the coil being substantially laterally symmetrical with respect to a central line from a top view perspective, and a shield laid out on a second metal layer secured by the dielectric slab and configured in a tree topology. The shield is substantially laterally symmetrical with respect to the central line from the top view perspective, the tree topology including a plurality of clusters of branches, wherein each of said plurality of clusters of branches is associated with a respective metal segment of the coil and includes a primary branch and at least one set of secondary branches that are branched from the primary branch, parallel to one another, and oriented at a substantially forty-five-degree angle with respect to the respective metal segment from the top view perspective.

COMPONENT MAGNETIC SHIELDING FOR MICROELECTRONIC DEVICES

A microelectronic device may include a substrate, a component, a first plate, a second plate, and a shield. The component may be disposed at least partially within the substrate. The first plate may be disposed on a first side of the component. The second plate may be disposed on a second side of the component. The shield may be disposed around at least a portion of a periphery of the component.

COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
20190304671 · 2019-10-03 ·

A coil component includes a body having one surface and the other surface opposing each other in one direction and a plurality of wall surfaces connecting the one surface and the other surface to each other, a coil part including a coil pattern embedded in the body and forming at least one turn about one direction, first and second external electrodes connected to the coil part, formed, respectively, on both end surfaces opposing each other among the plurality of wall surfaces of the body and extending to one surface of the body, a shielding layer including a cap part disposed on the other surface of the body and a side wall part disposed on each of the plurality of wall surfaces of the body except both the end surfaces of the body, an insulating layer formed between the body and the shielding layer, and a seed layer formed between the insulating layer and the shielding layer.

COIL COMPONENT

A coil component includes: a body; a coil part including a coil pattern embedded in the body and having at least one turn winding around on one direction; first and second external electrodes disposed on a surface of the body and connected to the coil part; and a shielding via having a permeability higher than that of the body and extending along the one direction in the body.

COIL COMPONENT
20190279813 · 2019-09-12 ·

A coil component includes: a body having a first surface and a second surface opposing each other in one direction and including a core extending in the one direction; a coil portion embedded in the body and having at least one turn around the core; and an external electrode disposed at least on the first surface of the body and connected to the coil portion. A first distance from the coil portion to a third surface of the body is greater than a second distance from the coil portion to a fourth surface of the body. The third and fourth surfaces oppose each other and have the core disposed therebetween. Turns of the coil portion disposed between the third surface of the body and the core are more than those of the coil portion disposed between the fourth of the body and the core.

Common mode choke for eliminating electrostatic interference
20190272935 · 2019-09-05 ·

A common mode choke for eliminating an electrostatic interference is provided. Through dividing a conventional single winding into three separated windings, an internal winding capacitance is reduced and meanwhile an inductance of higher quality factor is generated; a common mode resistance is increased and a capacitance between turns is reduced; and a filtration efficiency of low frequency and high frequency is improved. Moreover, because a conventional single-hole structure is expanded to a two-hole structure and the conventional single winding is divided into three independent to windings, webs are formed in every winding hole, a first winding part, a second winding part and a third winding part. It is different from a single annular magnetic core that: multiple networks generated by a winding structure of the present invention will not be saturated under a same condition, so that an electrostatic interference of more than 6 kv can be eliminated.

COIL COMPONENT

A coil component includes: a body having a first surface and a second surface opposing each other in a thickness direction of the body and a wall surface connecting the first and second surfaces; a coil part including coil patterns and including at least one turn centered on the thickness direction; external electrodes disposed on the first surface of the body and electrically connected to the coil part; a shielding layer including a cap portion disposed on the second surface of the body and side wall portions disposed on the wall surface of the body and each having a first end connected to the cap portion; an insulating layer disposed between the body and the shielding layer; and a gap portion bounded by a second end of the shielding layer opposing the first end and the first surface of the body to expose portions of the wall surface.