An inductor includes a body including a substrate, a coil portion, including a top coil and a bottom coil disposed on one surface and the other surface of the substrate, respectively, and an encapsulation portion encapsulating the substrate and the coil portion, a first terminal electrode, disposed on a bottom surface of the body and connected to the top coil, and a second terminal electrode disposed on the bottom surface of the body and connected to the bottom coil, a third terminal electrode disposed between the first and second terminal electrodes and disposed on the bottom surface of the body, and a shielding layer disposed to cover the body. The shielding layer is connected to the third terminal electrode.

A coil component includes a body including a magnetic metal powder, and a coil portion in the body. First and second external electrodes are disposed on one surface of the body and connected to the coil portion, and a third external electrode includes a pad portion disposed on the one surface of the body and a side surface portion disposed on at least one side surface of the body. An insulating layer covers surfaces of the body other than the one surface and has an opening exposing the side surface portion of the third external electrode. A shielding layer is disposed on the insulating layer and is connected to the side surface portion of the third external electrode through the opening.

The present disclosure discloses an inductive device manufacturing method that includes the steps outlined below. An inductive unit is formed in an integrated circuit. An electromagnetic radiation test is performed thereon. When an amount of electromagnetic radiation exceeds a radiation threshold value, a shielding structure is formed. The shielding structure has a width and a distance separated from the inductive unit such that a decreasing amount of a quality factor of the inductive unit is not larger than a first predetermined value and a shielded amount of electromagnetic radiation is not lower than a second predetermined value. The inductive unit has a symmetric shape and the inductive device further includes a single asymmetric inductive portion. The closed shape of the shielding structure encloses the inductive unit and covers the single asymmetric inductive portion. A part of the single asymmetric inductive portion extends along a peripheral direction of the shielding structure.

The present disclosure discloses an inductive device having electromagnetic radiation shielding mechanism. The inductive device includes an inductive unit and a shielding structure. The shielding structure forms at least one closed shape that encloses the inductive unit. The shielding structure has a width thereof and a distance separated from the inductive unit such that a decreasing amount of a quality factor of the inductive unit is not larger than a first predetermined value and a shielded amount of electromagnetic radiation is not lower than a second predetermined value.

The present invention is directed to electrical circuits. and more specially, inductor designs that reduce on-chip electromagnetic coupling in certain applications. In a specific embodiment, the present invention provides an inductor that includes coils that are configured to generate magnetic fields of opposite polarities. The electromagnetic fields generated by the inductor coils substantially cancel out with each other, thereby minimizing parasitic inductance of the inductor and reducing interference with operations of other components in an integrated circuit. There are other embodiments as well.

Provided is a stacked electronic component having: a stacked body 1 in which ceramic layers 1a to 1h are stacked, the stacked body having an a upper surface U and side surfaces S; at least one recess portion 8 formed on the upper surface U that indicates at least one of a mark, a letter, or a number; electrodes 3, 4, 5, 6 formed between the layers of the stacked body 1; and a shield layer 9 formed on the upper surface U and the side surfaces S of the stacked body 1. Right below an inner bottom surface of the recess portion 8 of the stacked body 1, there is provided a no-electrode region NE in which the electrodes 3, 4, 5, 6 are not formed, the no-electrode region NE having a thickness which is equal to or larger than a depth of the recess portion 8.

A coil component includes: a body having a first surface and a second surface opposing each other in a thickness direction of the body and a wall surface connecting the first and second surfaces; a coil part including coil patterns and including at least one turn centered on the thickness direction; external electrodes disposed on the first surface of the body and electrically connected to the coil part; a shielding layer including a cap portion disposed on the second surface of the body and side wall portions disposed on the wall surface of the body and each having a first end connected to the cap portion; an insulating layer disposed between the body and the shielding layer; and a gap portion bounded by a second end of the shielding layer opposing the first end and the first surface of the body to expose portions of the wall surface.

A circuit board includes a glass substrate having a first surface and a second surface facing away from the first surface; a first coil wiring pattern formed on the first surface and a second coil wiring pattern formed on the second surface, the first and second coil wiring patterns constituting part of a coil; a through hole extending through a predetermined portion of the glass substrate from an end of the first coil wiring pattern to an end of the second coil wiring pattern; a through hole inner conductive surface formed on the inner side of the through hole, the first and second coil wiring patterns and the through hole inner conductive surface constituting the coil wound around a direction perpendicular to an axis of the through hole and to a direction in which the first and second coil wiring patterns extend.

The present invention is directed to electrical circuits. and more specially, inductor designs that reduce on-chip electromagnetic coupling in certain applications. In a specific embodiment, the present invention provides an inductor that includes coils that are configured to generate magnetic fields of opposite polarities. The electromagnetic fields generated by the inductor coils substantially cancel out with each other, thereby minimizing parasitic inductance of the inductor and reducing interference with operations of other components in an integrated circuit. There are other embodiments as well.

A multi-phase buck switching converter having grouped pairs of phases, each phase using two magnetically coupled air-core inductors. For each group, a first driver circuit controlling switching of a first power transistor switching circuit coupled to a first air-core inductor output for driving an output load at the first phase. A second driver circuit controlling switching of a second power transistor switching circuit coupled to a second air-core inductor output for driving said output load at the second phase. The first and second phases are spaced 180° apart. The coupled air-core inductors per group of such orientation, separation distance and mutual inductance polarity relative to each other such that magnetic coupling between the two or more inductors at each phase results in a net increase in effective inductance per unit volume. Each air-core inductor is a metal slab of defined length, height and thickness formed using back-end-of-line semiconductor manufacturing process.