A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and a wall surface connecting the one surface and the other surface, a coil portion embedded in the body and having an end exposed to the wall surface of the body, an external electrode including a connecting portion disposed on the wall surface of the body and connected to the end of the coil portion, and an extension extending from the connecting portion onto the one surface of the body, a first insulating layer covering the other surface of the body, and an identification portion passing through the first insulating layer and including the same material as a material of the external electrode.

A coil component in which occurrence of plating elongation is further suppressed and an inductance value is higher. A coil component includes an element body including metal magnetic particles, a coil conductor inside the element body, and a plurality of external electrodes on a surface of the element body. The element body has a substantially rectangular parallelepiped shape including upper and lower surfaces substantially orthogonal to a winding axis of the coil conductor, first and second side surfaces facing each other, and third and fourth side surfaces facing each other. An average particle diameter of each of metal magnetic particles constituting the upper surface, metal magnetic particles constituting the lower surface, metal magnetic particles constituting the first side surface, and metal magnetic particles constituting the second side surface is smaller than an average particle diameter of metal magnetic particles existing inside a winding portion of the coil conductor.

A coil component includes a body having one surface and the other surface opposing each other, and one side surface and the other side surface, respectively connecting the one surface and the other surface to each other and opposing each other in one direction, a wound coil embedded in the body, a lead portion extending from an end of the wound coil to one surface of the body and disposed on the one surface of the body, an insulating layer covering one surface of the body and having an opening exposing a portion of the lead portion and extending in the one direction, and an external electrode disposed in the opening and connected to the lead portion. The insulating layer includes finishing portions respectively disposed on opposing sides of the opening in the one direction.

In a coil component, a second magnetic portion disposed in the vicinity of a coil is designed to have a higher proportion of Fe than a metal magnetic powder-containing resin constituting a first magnetic portion. Therefore, a magnetic flux of the coil flows smoothly. Although the second magnetic portion has a relatively lower withstand voltage than the first magnetic portion, since the second magnetic portion is surrounded by the first magnetic portion, it is not exposed on an outer surface of a magnetic body. For this reason, a situation in which the coil and external terminal electrodes are short-circuited with the second magnetic portion therebetween is effectively curbed, and short-circuiting between the coil and the external terminal electrodes can be curbed.

In a coil component, an uneven structure provided by an insulation layer and a resin wall contributes to extension of a contact area with respect to a magnetic body, so that an adhesive force with respect to the magnetic body is improved. In addition, the magnetic body protrudes downward toward an exposed region of the resin wall corresponding to a recessed portion in the uneven structure, a volume thereof is increased, and coil characteristics such as an inductance value are improved.

A Fe-based alloy represented by a composition of (Fe.sub.(1-a)M.sup.1.sub.a).sub.100-b-c-d-e-f-gM.sup.2.sub.bM.sup.3.sub.cB.sub.dP.sub.eCu.sub.fTi.sub.g, wherein M.sup.1 is at least one element selected from the group consisting of Co and Ni, M.sup.2 is at least one element selected from the group consisting of Nb, Mo, Zr, Ta, W, Hf, Ti, V, Cr, and Mn, M.sup.3 is at least one element selected from the group consisting of Si, Al, Ga, and Ge, and a, b, c, d, e, f, and g satisfy the following content conditions: 0≤a≤0.5, 0<b≤1.5, 0<c≤4, 7≤d≤13, 0.1≤e≤5, 0.6≤f≤1.5, and 0<g, is provided, wherein a full width at half maximum of an XRD main peak is 0.172 or more.

A coil component includes: a body containing magnetic metal particles and an insulating resin; a coil portion disposed in the body; and first and second external electrodes disposed on the body while being spaced apart from each other and connected to opposite end portions of the coil portion, respectively, wherein a surface of the body has first and second regions in which the first and second external electrodes are disposed, respectively, and a third region in which the first and second external electrodes are not disposed, some of the magnetic metal particles are exposed to the third region of the body, and a monomolecular organic material having a hydrophobic portion is disposed at an exposed surface of the magnetic metal particle exposed to the third region of the body.

A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.

A coil component includes a body; a supporting substrate embedded in the body; a coil portion including a coil pattern, and a lead-out pattern exposed to an outside of the body through an external surface of the body, and disposed on the supporting substrate and embedded in the body; and an insulating film disposed between the coil portion and the body, wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.

There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.