A reactor 1 according to the present invention includes a coil 2 and a magnetic core 3 where the coil 2 is disposed. In the reactor 1, a core part 4A (4B) including a stacked columnar body having a plurality of core pieces 31m and a plurality of gap members 31g stacked and coating resin 5A (5B) in which a peripheral surface coating portion 51oA (51oB) for coating an outer peripheral surface of the stacked columnar body to integrally hold the core piece 31m and the gap member 31g and an end surface coating portion 51eA for coating one end surface of the stacked columnar body are molded integrally is used for a part of the magnetic core 3, that is, an inner core 31. A manufacturing error of the core piece 31m or the gap member 31g is absorbed by the end surface coating portion 51eA. Consequently, the core part 4A (4B) can be molded with high accuracy and an outer core 32 can be assembled properly. Thus, the reactor 1 has high assembling workability.

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Precision fabrication of 3D objects is used for fabricating passive electrical components. A 3D scaffold is fabricated and then electrically conductive and/or insulating layers are deposited on the scaffold to form the electrical component.

Precision fabrication of 3D objects is used for fabricating passive electrical components. A 3D scaffold is fabricated and then electrically conductive and/or insulating layers are deposited on the scaffold to form the electrical component.

A magnetic core for an inductive component is produced by thin-film technology, wherein the magnetic core consists of at least two different magnetic materials.

A noise filter and an electronic device including the same are disclosed. The noise filter is configured to suppress noise generated in a power line or a ground line of a power circuit unit provided in an electronic device. The electronic device including: at least one coil connected to the power line and the ground line; and a core around which the coil is wound, a common core portion configured to suppress common mode noise generated at the ground line and a normal core portion configured to suppress normal mode noise generated at the power line are formed as a single body. Thus, the common mode noise filter and the normal mode noise filter are integrated with each other to thereby improve productivity and reduce production costs.

A noise filter and an electronic device including the same are disclosed. The noise filter is configured to suppress noise generated in a power line or a ground line of a power circuit unit provided in an electronic device. The electronic device including: at least one coil connected to the power line and the ground line; and a core around which the coil is wound, a common core portion configured to suppress common mode noise generated at the ground line and a normal core portion configured to suppress normal mode noise generated at the power line are formed as a single body. Thus, the common mode noise filter and the normal mode noise filter are integrated with each other to thereby improve productivity and reduce production costs.

A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

A coil electrode 4 provided in a coil component 1a includes a plurality of inner metal pins 5a arranged on an inner peripheral side of a coil core 3, a plurality of outer metal pins 5b arranged on an outer peripheral side of the coil core 3 to form a plurality of pairs with the inner metal pins 5a, a plurality of lower wiring patterns 7 that connect lower ends of the inner metal pins 5a and the outer metal pins 5b in the pairs, and a plurality of upper wiring patterns 6 that connect upper ends of the outer metal pins 5b to upper ends of inner metal pins 5a adjacent to the inner metal pins 5a that form the pairs with the outer metal pins 5b.