A coil electrode of a coil component includes a plurality of lower wiring patterns arranged on a lower surface of an insulating layer; a plurality of upper wiring patterns arranged on an upper surface of the insulating layer; a plurality of inner conductors disposed at an inner peripheral side of the coil core, each inner conductor connecting one end of the corresponding one of the lower wiring patterns and one end of a corresponding one of the upper wiring patterns forming the pair with the lower wiring pattern; and a plurality of outer conductors disposed at an outer peripheral side of the coil core, each outer conductor connecting the other end of the corresponding one of the lower wiring patterns and the other end of the corresponding one of the upper wiring patterns adjacent to an upper wiring pattern forming the pair with the lower wiring pattern.

An electronic device package includes a molded case, a plurality of leads and a case lid. The molded case includes integrally formed side walls, end walls, and a bottom wall, which together define an interior for components. Each side wall includes top and bottom portions. The top portion includes first and second surfaces extending downward from a top edge of the side wall. The bottom portion has a top surface that extends away from the interior, a third surface extending downward from the top surface to a bottom edge, and a fourth surface extending downward from the second surface to the bottom wall. The leads are molded in the side wall from the bottom edge to the top edge. Each lead has an end extending above the top edge, and another end extending along the bottom edge of the side wall. The case lid is engaged with the molded case.

A monolithic power switch provides a semiconductor layer, a three dimensional FET formed in the semiconductor layer to modulate currents through the semiconductor layer, and a toroidal inductor with a ceramic magnetic core formed on the semiconductor layer around the FET and having a first winding connected to the FET.

Devices and methods of forming a device are disclosed. The method includes providing a wafer that includes a center insulator layer sandwiched by a top substrate and a bottom substrate. Both sides of the wafer are patterned and etched in sequence to form deep trenches in both substrates. A conductive seed layer is formed on both sides of the wafer in sequence to cover all exposed areas. Both sides of the wafer are electroplated simultaneously to fill both deep trenches with a conductive material. Both sides of the wafer are polished in sequence to form a coplanar surface. A protective layer is deposited on both sides of the wafer in sequence. Selective portions of the protective layer on both sides are patterned and etched in sequence to expose micro bump bonding areas. Micro bumps are formed on both sides of the wafer in sequence to facilitate electrical connection.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

Disclosed herein is an inductor component that includes a magnetic core having magnetic thin ribbons laminated in a z-direction, a first coil conductor inserted into first and second through holes penetrating the magnetic core in the z-direction, and a second coil conductor inserted into third and fourth through holes penetrating the magnetic core in the z-direction. Each of the magnetic thin ribbons is divided into a plurality of small pieces by net-shaped cracks. A periphery of each of the first to fourth through holes is surrounded by the plurality of small pieces without being circumferentially divided by a slit having a size larger than the crack.

A transformer includes a transformer core, a first wire, which forms a first winding, and a second wire, which forms a second winding. The first and second windings are wound around the transformer core. A preformed insulation structure is arranged between the first and second winding and designed to space apart the second winding from the first winding and the transformer core. The preformed insulation structure further includes a first shell which at least partially encloses the transformer core with the first winding, and a second shell which at least partially encloses the transformer core with the first winding. The first and second shells are identical. One or more holes are defined in the first shell and the second shell. The one or more holes cover more than 10% of a surface of the preformed insulation structure.

A wound core for stationary induction apparatus is provided that includes a wound core body, the core body being configured with laminated metal ribbons and provided in an upright manner, and a uniting binder provided on the outer circumference of the wound core body more sparsely toward the upper portion of the core body.

A noise current absorber including a pair of housing parts capable of housing each of the pair of magnetic bodies, wherein the pair of magnetic bodies forms an overall cylindrical shape or a ring shape when abutted against each other; an engaging portion and an engaged portion capable of maintaining a closed state of the pair of housing parts; and a wall molded integrally with at least a first housing part of the pair of housing parts, adjacent to an abutting surface of at least the first housing part against a second housing part of the pair of housing parts, the wall protruding to a side where the second housing part abuts.

Soft magnetic core, in which permeabilities that occur at least two different locations of the core are different.