A coil component includes a main body portion containing resin and having a hole portion, a coil provided in the main body portion, and a substantially cylindrical pipe arranged inside the hole portion. The coil includes an inner wiring embedded in the pipe and an outer wiring exposed from the main body portion. The inner wiring and the outer wiring are integrally continuous.

A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

According to one configuration, an inductor device includes a first electrically conductive path; a second electrically conductive path, the first electrically conductive path electrically isolated from the second electrically conductive path; first material, the first material operative to space the first electrically conductive path with respect to the second electrically conductive path; and second material. The second material has a substantially higher magnetic permeability than the first material. An assembly of the first electrically conductive path, the second electrically conductive path, and the first material resides in a core of the second material.

An LC filter arrangement includes a filter capacitor that connects the first output terminal to the second output terminal, a magnetic core, and a choke having a plurality of turns surrounding the magnetic core, and a first choke terminal and a second choke terminal. Each of the turns is formed by a separate conductor segment, at least partially surrounding the magnetic core. The LC filter arrangement is mounted on a circuit board and is electrically connected to a conductor track of the circuit board.

An LC filter arrangement includes a filter capacitor that connects the first output terminal to the second output terminal, a magnetic core, and a choke having a plurality of turns surrounding the magnetic core, and a first choke terminal and a second choke terminal. Each of the turns is formed by a separate conductor segment, at least partially surrounding the magnetic core. The LC filter arrangement is mounted on a circuit board and is electrically connected to a conductor track of the circuit board.

A coil component includes a core that includes a core part having a first end portion and a second end portion; and a first wire and a second wire that are wound around the core part from the first end portion to the second end portion in substantially helical shapes so as to have substantially the same number of turns. The first wire is wound so as to form a first layer that contacts the peripheral surface of the core part, the second wire is wound such that at least part of the second wire forms a second layer on the outside of the first layer, and a first coil length formed by the first wire is longer than a second coil length formed by the second wire.

A coil component includes: a coil embedded in a substrate body and having a winding part constituted by a wound conductor; wherein the substrate body has: a first region sandwiched between one end surface of the substrate body and a plane parallel with the one end surface and running through a portion of a first external electrode farthest away from the one end surface; a second region sandwiched between another end of the substrate body and a plane parallel with the another end surface and running through a portion of a second external electrode farthest away from the another end surface; and a third region between the first region and the second region; and the winding part is provided in the third region, and also in the first region where it is wound by one turn or more.

A method includes: forming an interconnect structure over a semiconductor substrate. The interconnect structure includes: a magnetic core and a conductive coil winding around the magnetic core and electrically insulated from the magnetic core, wherein the conductive coil has horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the horizontally-extending conductive lines, wherein the magnetic core and the conductive coil are arranged in an inductor zone of the interconnect structure. The interconnect structure also includes a dielectric material electrically insulating the magnetic core from the conductive coil, and a connecting metal line adjacent to and on the outside of the inductor zone. The connecting metal line is electrical isolated from the inductor zone. The connecting metal line includes an upper surface lower than an upper surface of the second conductive vias and a bottom surface higher than a bottom surface of the first conductive vias.

There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

The present invention provides an assembled magnetic inductor with insulating layer component, and more particularly to printing, adhesion, or spray coating an insulating layer material on a pre-press molded surface of one of two internal metal components to cause an insulating layer to form on the outer surface thereof. Hence, an insulating layer between the two metal components is dispensed with in the assembly of the combination magnetic inductance, thereby further decreasing inductance of the assembly components, as well as reducing inter-component gaps and magnetic leakage, and acoustic noise.