An EMI filter for an inverter may include a choke including a magnetic inner core, a magnetic outer core, and at least one conductor pair. The at least one conductor pair may include an electrically conductive positive conductor and an electrically conductive negative conductor. The inner core, the outer core, the positive conductor, and the negative conductor may extend along a longitudinal central axis of the choke. The inner core may be arranged in the outer core. The positive conductor and the negative conductor may be arranged between the inner core and the outer core. The positive conductor and the negative conductor may be arranged spaced apart from one another in a circumferential direction extending around the longitudinal central axis. A gap may be formed between the inner core, the outer core, the positive conductor, and the negative conductor, which are adjacent in the circumferential direction.

The present invention relates to a bracket device for bearing an inductor, an inductor device, and an uninterruptible power supply. The inductor comprises a toroidal magnetic core; and a coil comprising a plurality of wires wound around the toroidal magnetic core. The bracket device comprises: a bracket having a bearing portion adapted to bear the inductor; an insulating pad adapted to be sandwiched between the inductor and the bearing portion of the bracket, the insulating pad having an integrally formed positioning structure capable of being embedded between two adjacent wires of the coil and keeping the toroidal magnetic core fixed; and a fastener adapted to wrap around the toroidal magnetic core and press the toroidal magnetic core together with the insulating pad against the bracket. The bracket device of the present invention is capable of effectively fixing an inductor and allowing it to dissipate heat well.

The present invention relates to a bracket device for bearing an inductor, an inductor device, and an uninterruptible power supply. The inductor comprises a toroidal magnetic core; and a coil comprising a plurality of wires wound around the toroidal magnetic core. The bracket device comprises: a bracket having a bearing portion adapted to bear the inductor; an insulating pad adapted to be sandwiched between the inductor and the bearing portion of the bracket, the insulating pad having an integrally formed positioning structure capable of being embedded between two adjacent wires of the coil and keeping the toroidal magnetic core fixed; and a fastener adapted to wrap around the toroidal magnetic core and press the toroidal magnetic core together with the insulating pad against the bracket. The bracket device of the present invention is capable of effectively fixing an inductor and allowing it to dissipate heat well.

A substrate includes a multilayer substrate body in which a plurality of circuit bodies are laminated in a laminating direction through insulating layers and are interlayer connected via a connected conductor formed on each of the insulating layers, and a magnetic body that is arranged in the laminating direction while at least a part of or all of the magnetic body sandwiches the circuit bodies. Each of the circuit bodies includes at least a first circuit body and a second circuit body. The first circuit body is formed of a first extending portion and a first folding portion. The second circuit body is formed of a second extending portion and a second folding portion.

An apparatus includes a substrate, one or more integrated circuit dies on the substrate, and a stiffener affixed to the substrate. One or more sections of the stiffener may includes a magnetic material. The apparatus further includes an inductive circuit element comprising one or more conductive structures wrapped around the magnetic material. In some examples where a first coil is wrapped around a first section of the stiffener, and a second coil is wrapped around a second section of the stiffener, current supplied to the first coil generates at the second coil a current that is further transmitted to the one or more semiconductor dies.

It is highly desirable in electronic systems to conserve space on printed circuit boards (PCB). This disclosure describes voltage regulation in electronic systems, and more specifically to integrating voltage regulators and associated passive components into semiconductor packages with at least a portion of the circuits whose voltage(s) they are regulating.

A power system has a power-electronic module that includes a housing defining a looped reservoir, a ferro-magnetic medium sealed within and filling the looped reservoir, and a conductor surrounded by the ferro-magnetic medium. The conductor is coiled within and along the looped reservoir, and has terminals extending out of the reservoir such that the ferro-magnetic medium and conductor form an inductor that opposes changes in magnitude of current flowing through the conductor.

A common mode choke coil includes a core, and first and second coils opposed to each other and wound on the core. The core can have a square shape, or an elongated shape having a long axis and a short axis when viewed in a direction along a central axis of the core. Each of the first and second coils is a single-layer coil. An area of a cross-section of the core taken perpendicular to a circumferential direction of the core is constant in the circumferential direction of the core. The cross-section of the core has a quadrilateral shape.

A thermal management includes an inductor, a housing in thermal communication with the inductor, the housing defining a wall, and a conductor. The conductor has a greater heat transfer rate than the wall and is positioned within a groove and/or an aperture formed in the wall. The conductor is configured to transfer heat through the wall more efficiently than if the conductor were not present. A method of manufacturing a thermal management system includes forming a housing by additive manufacturing. The housing defines a wall having at least one of a groove and an aperture defined therein. The method includes positioning a conductor in at least one of the groove and the aperture. The conductor has a greater heat transfer rate than the wall. The method includes positioning an inductor into thermal communication with the housing.

According to one configuration, a fabricator receives magnetic permeable material and fabricates an apparatus to include a multi-dimensional arrangement of electrically conductive paths to extend through the magnetic permeable material. Each of the electrically conductive paths is a respective inductive path.