A method of making a slow wave inductive structure includes forming a first conductive winding over a first substrate. The method further includes bonding a second substrate to the first substrate, wherein the second substrate has a thickness ranging from about 50 nanometers (nm) to about 150 nm, wherein a distance between the first conductive winding and the second substrate ranges from about 1 micron (?m) to about 2 ?m.

In one aspect, an apparatus includes: a first power amplifier to receive a first voltage signal and to output a first current; a second power amplifier to receive a second voltage signal and to output a second current; and a transformer coupled to the first power amplifier and the second power amplifier. The transformer may have multiple differential input ports to realize a controllable impedance based on a desired output power level.

An inductor is disclosed that includes an arrangement of lobes, each of the lobes in the arrangement of lobes including a generator, the arrangement of lobes interconnected such that, when currents are provided by each generator in the arrangement of lobes, each lobe in the arrangement of lobes produces a magnetic field with a defined polarity relative to the arrangement of lobes. When the arrangement of lobes are appropriately interconnected, the magnetic field from the arrangement of lobes can be canceled.

A tunable inductor arrangement includes a first winding part connected at one end to a first input of the inductor arrangement, a second winding part connected at one end to the other end of the first winding part, a third winding part connected at one end to a second input of the inductor arrangement, and a fourth winding part connected at one end to the other end of the third winding part. For tuning, the inductor arrangement includes a switch arrangement switchable between a first setting series-connecting the first and third winding parts between the inputs, and a second setting series-connecting the first, second, fourth and third winding parts between the inputs. The first and third winding parts are arranged on a chip or substrate with essentially common magnetic fields, and the second and fourth winding parts are arranged to cancel electro-magnetic coupling with the first and third winding parts.

A varainductor includes a signal line, a ground plane, and a floating plane over a substrate. The ground plane is disposed on a side of the signal line, and the first floating plane is disposed between the ground plane and the signal line. An array of switches includes at least two switches configured to selectively electrically connect the ground plane to the floating plane.

A tunable inductor arrangeable on a chip or substrate comprises a first winding part connected at one end to a first input of the tunable inductor arrangement, a second winding part connected at one end to the other end of the first winding part, a third winding part connected at one end to a second input of the tunable inductor arrangement, a fourth winding part connected at one end to the other end of the third winding part, and a switch arrangement arranged. The switch arrangement tunes the tunable inductor by selectively connecting the first and fourth winding parts in parallel and the second and third winding parts in parallel, with the parallel couplings in series between the first and second inputs, or connecting the first, second, fourth and third winding parts in series between the first and second inputs. Corresponding transceivers, communication devices, methods and computer programs are disclosed.

Certain aspects of the present disclosure provide an integrated impedance matching and filtering circuit. One example circuit generally includes an impedance matching circuit having a first inductor and a resonant circuit having a resonant frequency and comprising a second inductor magnetically coupled to the first inductor. The resonant circuit is configured to filter out the resonant frequency from the impedance matching circuit. In certain aspects, the resonant circuit may further include a capacitor. The second inductor may include a ring of metal having a gap, and the capacitor may comprise a dielectric material between ends of the ring surrounding the gap. For other aspects, the capacitor may be an integrated circuit element, having a fixed or variable value.

A wireless power transmitter includes a source resonator configured to wirelessly transmit power via magnetic coupling with a target resonator; and an impedance adjusting unit configured to adjust an impedance of the source resonator using a plurality of impedance-matching bars located in the source resonator.

A varainductor including a signal line disposed over a substrate. The varainductor further includes a first ground plane over the substrate, the first ground plane disposed on a first side of the signal line, and a second ground plane over the substrate, the second ground plane disposed on a second side of the signal line opposite the first side of the signal line. The varainductor further includes a first floating plane over the substrate, the first floating plane disposed between the first ground plane and the signal line, and a second floating plane over the substrate, the second floating plane disposed between the second ground plane and the signal line. The varainductor further includes an array of switches, the array of switches is configured to selectively connect the first ground plane to the first floating plane, and to selectively connect the second ground plane to the second floating plane.

A multi-terminal chip inductor includes coil conductors in base material layers, an interlayer connection conductor connecting the coil conductors across layers, and external electrodes each connected to portions of a series of coil conductors defined by the coil conductors and the interlayer connection conductor. The external electrodes include a common external electrode. A first of the coil conductors to which the common external electrode and a first external electrode adjacent to the common external electrode in a circuit are connected, includes first coil conductors connected to each other in parallel.