The present invention discloses an electronic device having a multi-lobe differential inductor with two terminals fabricated on a P-substrate, The electronic device comprises a broken ring electrically coupled with the ground ring (M5), positioned around a perimeter of the substrate such that the inductor is surrounded by the ground ring and the broken ring. The broken ring defines a plurality of parallelly arranged structures; each structure comprises a plurality of metal segments (M.sub.1-M.sub.4, M.sub.6-M.sub.10) parallel to each other and electrically connected to and perpendicular to the ground ring.

Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods. The IC package includes an impedance tuner circuit that includes a tunable inductor that can be tuned to change the frequency response of the impedance tuner circuit. To reduce the circuit area, the tunable inductor is formed in a RDL of a package substrate of the IC package. The IC package also includes a semiconductor die (die) that includes other components of the impedance tuner circuit that are coupled to the tunable inductor by the die being coupled to the package substrate. In this manner, by the tunable inductor being formed in a RDL in the package substrate, the signal path lengths between the tunable inductor and other components of the tunable impedance circuit are reduced, thereby reducing inductance path resistance and improving quality (Q) factor of the tunable inductor.