Patent classifications
H01F27/022
INTEGRATED SEMICONDUCTOR DEVICE ISOLATION PACKAGE
In a described example, an apparatus includes a transformer including: an isolation dielectric layer with a first surface and a second surface opposite the first surface; a first inductor formed over the first surface, the first inductor comprising a first layer of ferrite material, and a first coil at least partially covered by the first layer of ferrite material; and a second inductor formed over the second surface, the second inductor comprising a second layer of ferrite material and a second coil at least partially covered by the second layer of ferrite material.
EXCITER AND ELECTRONIC PRODUCT
The present disclosure provides an exciter and an electronic product. The exciter comprises: a magnetic circuit assembly comprising a first housing and a magnet, and the magnet is connected to the first housing; a coil assembly comprising a second housing and a coil, and the coil is disposed in a magnetic field formed by the magnet, wherein the coil assembly is configured to be capable of generating a vibration relative to the magnetic circuit assembly, the coil is formed by winding a wire having a polygonal cross section. According to the present disclosure, the coil wire has a polygonal cross section, so that an interval between the wires can be reduced in the wound coil, the number of turns of the coil is increased in the same space, the effective length of the coil is increased, and the driving force generated from the coil is increased.
Reactor
A reactor includes an assembly, stored in a case, including a coil and a magnetic core; an insertion member, having a type A durometer hardness of 50 or higher, that is stored side-by-side with the assembly; and a sealing resin portion that fills the case. The case includes a bottom portion and a side wall portion. The insertion member includes a leading end portion separated from the bottom portion via a gap. A space formed between the assembly and the case and between the insertion member and the case includes a first region provided between the bottom portion and the leading end portion and a second region that is a region other than the first region. The sealing resin portion includes a first resin portion that fills the first region and a second resin portion that fills at least a portion of the second region.
Coil component
A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 μm<T2<120 μm.
Transformers with build-up films
In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.
A THERMAL CONDUCTIVE COMPOUND FOR SEALING A POWER TRANSFORMER ASSEMBLY AND A POWER TRANSFORMER ASSEMBLY
A thermal conductive compound for sealing a power transformer assembly and a power transformer assembly, the thermal conductive compound having a silicone resin and fillers. The fillers at least include a first filler, or main filler, and a second filler. The first filler is a natural mineral filler including finely divided quartz, quartzite, marble, sand and/or calcium carbonate. The second filler includes a given amount of aluminium hydroxide lowering linear expansion coefficient and increasing the thermal conductivity of the silicone resin.
INSULATING DEVICE
An insulating device includes a first element, a second element, a first lead, a second lead, and a resin member. The second element is electrically connected to the first element. The first element is mounted on the first lead. The second lead includes a first surface and a second surface, the second surface being at a side opposite to the first surface. The second element is mounted to the first surface. the second lead is arranged to overlap the first element in a direction crossing the second surface of the second lead. The resin member seals the first element, the second element, the first lead, and the second lead.
COIL COMPONENT
A coil component includes a core including a core body, first and second flanges at first and second ends, respectively, of the body; first and second outer electrodes on the first and second flanges, respectively; and a wire wound around the body and electrically connected to the electrodes. The body has a peripheral face extending in a peripheral direction about an axis of the body. In a section containing the axis, a distance between at least a part of the face and the axis is smaller on a side near a center of the body in a direction of the axis than on a side near each of the first and second ends while a distance between the wire and the axis is smaller on the side near the center in the direction of the axis than on the side near each of the first and second ends.
INTEGRATED VOLTAGE REGULATOR
An integrated voltage regulator comprises a plurality of semiconductor devices and a circuit board including a plurality of thermally conductive inlays. At least one of the plurality of electronic devices is thermally coupled to at least one of the plurality of thermally conductive inlays. A substrate is thermally coupled to the circuit board and to the plurality of thermally conductive inlays.
ELECTRONIC MODULE
An electronic module comprising electrical components on a circuit board and a molding body disposed on the circuit board to encapsulate the electrical components, wherein a recess is formed in the molding body for exposing an electrode of the electronic module for connecting with an external component.