H01F27/027

Magnetic power coupling to an integrated circuit module

A magnetic power supply coupling system is disclosed. An integrated circuit module includes an integrated circuit die and a secondary winding that is configured to generate an induced, alternating current based on a magnetic flux. A primary winding is external to the integrated circuit module, proximate to the integrated circuit module, and coupled to a main power supply corresponding to an alternating current that generates the magnetic flux. The induced, alternating current is converted into a direct current at a voltage level to supply power to the integrated circuit die.

Arrayed embedded magnetic components and methods
10347409 · 2019-07-09 · ·

Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits.

System in package device including inductor

Described examples include a system in package (SIP) device, including: a first leadframe having a first surface and a second surface opposite the first surface; an integrated circuit die including solder bumps on a first surface and having a second opposite surface, the solder bumps mounted to the second surface of the first leadframe; a second leadframe having a first surface including a die pad portion, and a second opposite surface, the die pad portion attached to the second surface of the integrated circuit die; and an inductor mounted to the first surface of the first leadframe, the inductor having terminals with exterior portions electrically connected and mechanically connected to the first surface of the first leadframe, the inductor terminals spaced from one another by a portion of an inductor body, the portion of the inductor body between the inductor terminals spaced from the first surface of the first leadframe by a gap of at least 100 ms.

Method of manufacturing an electronic component

An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.

Electronic component and method for manufacturing an electronic component

The electronic component comprises at least a first electronic element arranged inside a first casing of magnetic material and at least a second electronic element arranged inside a second casing of magnetic material. At least a first outer surface of the first casing and at least a second outer surface of the second casing are connected to each other with a non-magnetic layer and with at least one connection support. The connection support is adapted to be tension-resistant and is adapted and arranged such that the connection support substantially completely prevents an increase in a distance between the first outer surface and the second outer surface upon heating the non-magnetic layer.

Coil-based electromagnetic wave resonance transfer device for improving energy efficiency
12027875 · 2024-07-02 ·

The present invention relates to a coil-based electromagnetic wave resonance transfer device for improving energy efficiency, which comprises: a housing; an electronic circuit board which is installed in the housing and senses an external signal generated outside the housing, to generate an electric wave signal having a specific waveform, of which a frequency is adjusted by using a multi-frequency modulation method; and a coil member which is installed in the housing and generates a resonant magnetic field through the electric wave signal output from the electronic circuit board to output an electromagnetic resonance wave to the outside of the housing.

CURRENT TRANSFORMER ASSEMBLIES

A current transformer for a ground fault circuit interrupter (GFCI) can include a core having a closed loop shape having a first side, a second side, and a core opening, and a sense coil wrapped around the core configured to magnetically couple to a plurality of conductors passing through the core opening. The current transformer can include a first magnetic shield disposed on the first side of the core over the sense coil, and a second magnetic shield disposed on a second side of the core over the sense coil.

BIORTHOGONAL WINDINGS ON TRANSFORMER AND COMMON MODE CHOKE FOR NETWORK PORT

In one embodiment, an apparatus includes a plurality of transformers and a plurality of common mode chokes, each of the transformers and the common mode chokes comprising a magnetic core and windings wound around the magnetic core at generally opposite sides thereof. The transformers and common mode chokes are arranged in an array with the windings on each of the magnetic cores positioned generally orthogonal to the windings of adjacent magnetic cores in the array to reduce crosstalk and improve common mode noise rejection.

Electrical junction box

An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.

INTEGRATED VERTICAL INDUCTOR
20190139690 · 2019-05-09 ·

An integrated vertical inductor includes a bobbin having an elongated, hollow tube, an upper flange disposed at an upper end of the elongated, hollow tube, and a base structure integrated with a lower end of the elongated, hollow tube. The elongated, hollow tube comprises a central opening extending along its longitudinal direction. The base structure comprises a lateral opening communicating with the central opening. A first magnetic core piece is installed in the central opening of the elongated, hollow tube. A second magnetic core piece is juxtaposed with the first magnetic core piece. A plurality of electrodes is disposed on a bottom surface of the base structure.