A current transformer includes a first housing including a first handle portion and a first distal portion, a second housing including a second handle portion and a second distal portion, a first core mounted in in the first distal portion, a second core mounted in the second distal portion, and a lock attached to the second handle portion at a pivot point, wherein the first housing is rotationally coupled to the second housing about a fulcrum point and the lock is rotatable about the pivot point into a closed position wherein the lock engages the first handle portion and prevents the first handle portion and the second handle portion from rotating towards each other.

A manufacturing method of an integrally formed inductor, comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides a manufacturing method of an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability.

Embodiments disclosed herein include systems and methods for mounting electrical components in electrical systems. In one example, there is provided a heat-generating electrical component and base assembly configured to be secured to a component wall. The assembly comprises a base including an upper portion having a recess and a lower portion having a floating electrical connector, a heat-generating electrical component secured in the recess of the base and including an electrical lead in electrical communication with the floating electrical connector, and a gasket circumscribing a perimeter of the lower portion.

Described examples include a system in package (SIP) device, including: a first leadframe having a first surface and a second surface opposite the first surface; an integrated circuit die including solder bumps on a first surface and having a second opposite surface, the solder bumps mounted to the second surface of the first leadframe; a second leadframe having a first surface including a die pad portion, and a second opposite surface, the die pad portion attached to the second surface of the integrated circuit die; and an inductor mounted to the first surface of the first leadframe, the inductor having terminals with exterior portions electrically connected and mechanically connected to the first surface of the first leadframe, the inductor terminals spaced from one another by a portion of an inductor body, the portion of the inductor body between the inductor terminals spaced from the first surface of the first leadframe by a gap of at least 100 ms.

A circuit device includes a coil component and a substrate. The coil component includes first and second coils whose openings overlap, a terminal connected to one end of the first coil, a terminal connected to another end of the first coil, a terminal connected to one end of the second coil, and a terminal connected to another end of the second coil. The substrate includes a power supply line electrically coupled to the terminal, a power supply line electrically coupled to the terminal, and a wiring line electrically coupled to the terminal and the terminal. The wiring line is also electrically coupled to the capacitor.

A reactor includes a core and first and second coils wound around the core about first and second center axes extended in a first direction, respectively. The core includes first and second core legs disposed inside the first and second coils, respectively. The first and second coils are arranged in a second direction perpendicular to the first direction. The first coil includes a first wound-wire part wound around the first core leg and two first terminal parts extended from both end portions of the first wound-wire part, respectively. The second coil includes a second wound-wire part wound around the second core leg and two second terminal parts extended from both end portions of the second wiring wire part, respectively. The second coil has the same shape and the same dimension as the first coil.

A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.

Disclosed are apparatus and methods for a magnetic component. In accordance with an embodiment, a magnetic component comprises a base substrate defining a winding cup having a shape of a closed groove surrounding a hub. The winding cup defines a core space operable to receive a core therein. A first conductive pattern is disposed on at least a portion of the base substrate including the winding cup. A second substrate defines a second conductive pattern. The second substrate is coupled to the first base surface with the first conductive pattern in operable alignment with the second conductive pattern. The first and second conductive patterns are coupled in electrical communication so as to define one or more winding-type electric circuits surrounding the core space so as to induce a magnetic flux within the core space when the one or more electric circuits are energized by a voltage source.

An electronic device package box is mounted with multiple coil components, is mounted on a circuit board, and includes a box unit, and multiple outer and inner connecting pins. The box unit includes inner and outer surrounding walls, a surrounding base wall connected between the inner and outer surrounding walls, and a surrounding space for receiving the coil components therein. The outer connecting pins are mounted to the outer surrounding wall, and each is connected to a corresponding one of the coil components and the circuit board. The inner connecting pins are mounted to the inner surrounding wall, and each is connected to a corresponding one of the coil components and the circuit board.

The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.