Patent classifications
H01F27/027
Integrated vertical inductor
An integrated vertical inductor includes a bobbin having an elongated, hollow tube, an upper flange disposed at an upper end of the elongated, hollow tube, and a base structure integrated with a lower end of the elongated, hollow tube. The elongated, hollow tube comprises a central opening extending along its longitudinal direction. The base structure comprises a lateral opening communicating with the central opening. A first magnetic core piece is installed in the central opening of the elongated, hollow tube. A second magnetic core piece is juxtaposed with the first magnetic core piece. A plurality of electrodes is disposed on a bottom surface of the base structure.
Electronic device packaging box
An electronic device packaging box includes a first base, a second base and a connecting unit. The first base includes two side walls spaced apart from each other in a first direction and each having a first side receiving space, and a connecting wall interconnecting the side walls to define a receiving space. The second base is received in the receiving space, and includes spaced-apart top and bottom walls, and a separating wall interconnecting the top and bottom walls to define two second side receiving spaces. The connecting unit includes two first connecting subunits, each of which is mounted to a respective one of the side walls, and two second connecting subunits, which are mounted to the bottom wall.
Modular transformer system
A transformer system includes a transformer module and a base module. One or more transformer modules are detachably coupled to the base module. The transformer module includes a housing, a transformer, primary-side and secondary-side wires electrically connected to primary and secondary terminals of the transformer, a conductive tab electrically connected to a neutral terminal of the transformer, and a first coupling mechanism. The base module includes a base enclosure, a neutral connector electrically connected to a power line neutral connection, and a second coupling mechanism. The second coupling mechanism detachably engages the first coupling mechanism of the transformer module, and the conductive tab of the transformer module is electrically connected to the neutral connector of the base module when the first coupling mechanism is engaged with the second coupling mechanism.
ELECTRONIC APPARATUS
An electronic apparatus includes a base including a surrounding wall defining first and second receiving spaces and having first and second end surfaces, and an electronic module including a terminal unit, and first and second electronic units respectively received in the first and second receiving spaces. The terminal unit includes two first terminals connected to the first electronic unit, two second terminals connected to the second electronic unit, and two connecting terminals, each of which has first and second sections respectively extending from the first and second end surfaces and connected to the first and second electronic units, and an interconnecting section embedded within the base and interconnecting the first and second sections.
Electrical component package with reinforced molded pins
An electronic device package includes a molded case, a plurality of leads and a case lid. The molded case includes integrally formed side walls, end walls, and a bottom wall, which together define an interior for components. Each side wall includes top and bottom portions. The top portion includes first and second surfaces extending downward from a top edge of the side wall. The bottom portion has a top surface that extends away from the interior, a third surface extending downward from the top surface to a bottom edge, and a fourth surface extending downward from the second surface to the bottom wall. The leads are molded in the side wall from the bottom edge to the top edge. Each lead has an end extending above the top edge, and another end extending along the bottom edge of the side wall. The case lid is engaged with the molded case.
APPARATUS FOR AN INDUCTOR DISPOSED IN A BAND FOR METHOD OF HEAT DISPERSION
Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
Galvanically Isolated Driver Package for Switch Drive Circuit with Power Transfer
The present application provides a packaged gate drive circuit having a transformer. The transformer which is used to transfer both signals and power from a primary side to a secondary side. The windings of the transformer are formed using a combination of tracks and wirebond wires. The transformer is positioned in a well formed using a first insulating material and covered with a second insulating material.
INTEGRATED CHIP INDUCTOR STRUCTURE
The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.
INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT
An inductor component includes a main body including a magnetic layer, an inductor wiring disposed in the main body, and vertical wirings each of which is connected to the inductor wiring and each of which extends from a portion in which the vertical wiring and the inductor wiring are connected to each other to a first main surface of the main body. A second main surface of the main body is located on the side of the inductor wiring that is opposite to the side of the inductor wiring on which the first main surface is located. The first main surface is covered with a first outer layer having an insulating property, and the second main surface is covered with a second outer surface having an insulating property. The first outer layer and the second outer layer each contain a colorant.
Wire-wound coil element
One object of the present invention is to provide a coil element having a reduced thickness but is less prone to be broken. The coil element according to an embodiment of the present invention has a rectangular parallelepiped shape and has a principal surface including long sides and short sides. The coil element includes a drum core, a winding wound around the drum core, a first external electrode electrically connected to one end of the winding, and a second external electrode electrically connected to the other end of the winding. The drum core in the embodiment includes a first flange, a second flange, and a winding core connecting between the first flange and the second flange. The winding core extends along the short sides of the principal surface.