H01F2027/065

Heat dissipation structure for magnetic component and magnetic component having the same

The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.

MAGNETIC DEVICE AND POWER CONVERSION MODULE

A power conversion module is disclosed. The power conversion module includes a circuit board, an adapter board, a first component and a second component. The second surface of the circuit board includes a concave region. The circuit board has four sidewalls. The first surface of the adapter board is attached to the second surface of the circuit board. The first surface of the adapter board includes a component disposing region, and the component disposing region is corresponding to the concave region. The first component is disposed in the concave region. A height of the first component is less than or equal to a depth of the concave region. The second component is disposed in the component disposing region and accommodated in the corresponding one of the concave region. A height of the second component is less than or equal to the depth of the concave region.

PLANAR TRANSFORMER AND BOBBIN ASSEMBLY APPLIED THERETO
20230104796 · 2023-04-06 ·

The following disclosure relates to a planar transformer and a bobbin assembly applied thereto, and more particularly, to a planar transformer in which pins may be firmly fixed through a bobbin body, a bobbin assembly may be conveniently assembled to a transformer board using snap protrusions of the bobbin body, and a total height of the planar transformer may be lowered using a flange part at the time of mounting the planar transformer, and a bobbin assembly applied thereto.

POWER CONVERSION MODULE AND MAGNETIC DEVICE THEREOF
20220319759 · 2022-10-06 ·

A magnetic device includes a magnetic core assembly, a primary winding, a first secondary winding and a second secondary winding. The magnetic core assembly includes a first magnetic cover, a second magnetic cover, a first magnetic leg, a second magnetic leg, a third magnetic leg and a fourth magnetic leg. The primary winding is wound around the first magnetic leg and the third magnetic leg. A first terminal of the first secondary winding is disposed between the first magnetic leg and the second magnetic leg. A second terminal of the first secondary winding is disposed between the third magnetic leg and the fourth magnetic leg. A first terminal of the second secondary winding is disposed between the first magnetic leg and the fourth magnetic leg. A second terminal of the second secondary winding is disposed between the second magnetic leg and the third magnetic leg.

TRANSFORMER

A transformer including a winding frame, a first coil, a second coil, a locating piece, and two iron core pieces is provided. The winding portion has a through hole. The first baffle and the second baffle are respectively and horizontally extended from two opposite ends of the winding portion. The terminal socket is connected to the second baffle. The first coil is wound on the winding portion and electrically coupled to the terminal socket. The second coil is disposed around the first coil and the two are spaced apart from each other. The second coil has a plurality of copper sheets located between the first baffle and the second baffle. The locating piece is correspondingly disposed on the winding frame to locate the second coil. The two iron core pieces are respectively disposed on the second baffle of the winding frame and the locating piece.

Low-profile housing for electronic components
11646145 · 2023-05-09 · ·

A low-profile high minimum creepage housing for electronic components such as transformers is provided. The housing can include a body and a lid. The lid can have attachment members that secure the lid to the body, after an electronic component is installed into the body. The attachment members of the lid may also secure a wire routed along the outside of the body against the body. The lid may include protruding portions that extend into the body, thereby elongating a minimum creepage path.

SYSTEM AND METHOD FOR VERTICAL POWER DELIVERY TO ELECTRONIC SYSTEMS

According to various embodiments, a power converter circuit is disclosed. The power converter circuit includes at least two vertically stacked printed circuit boards (PCBs) comprising a top PCB and a bottom PCB. The power converter circuit further includes at least one multiphase coupled inductor placed between the top PCB and the bottom PCB. The top PCB is coupled to the bottom PCB via at least one conductive winding of the multiphase coupled inductor. The power converter circuit further includes at least one circuit module placed above the top PCB and at least one power source placed below the bottom PCB. The multiphase coupled inductor is configured to deliver current vertically from the bottom PCB to the top PCB.

ELECTRONIC CIRCUIT WITH ISOLATION

A circuit comprises a first printed circuit board (60) carrying a first set of components and a second printed circuit board (62) carrying a second set of components, with a clearance (64) between the first and second printed circuit boards. A transformer (66) has a primary side connected to the first set of components and a secondary side connected to the second set of components. One of the transformer windings, and its connection to a respective set of components, comprises a triple insulated wire. A glass, ceramic or mica spacer (70) mounted to the first and second printed circuit boards defines and sets the clearance (64) between the first and second printed circuit boards. The clearance requirement is met by providing separate printed circuit boards with spacing between them and the use of a triple insulated wire addresses or overcomes issues of creepage. Thus, high frequency and high voltage operation on the first printed circuit board is possible.

COIL COMPONENT, CIRCUIT BOARD ARRANGEMENT AND ELECTRONIC EQUIPMENT
20230197327 · 2023-06-22 ·

A coil component includes at least one outer electrode, an element body and a conductor. The element body includes a first surface on which at least a portion of each of the outer electrode(s) is provided, a second surface immediately adjacent to the first surface, a core portion extending from the second surface in axial direction of the core portion, and a recess having a curved concave surface replacing at a portion of a ridge line between the first surface and the second surface. The conductor includes a winding portion that extends around a periphery of the core portion of the element body, a junction portion that is electrically joined to the outer electrode at the first surface, and a lead portion that passes through the recess and connects one end of the winding portion to the junction portion via the recess.

COIL COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING COIL COMPONENT
20230197328 · 2023-06-22 ·

A coil component includes an element body, a conductor, and at least one outer electrode. The element body has a first face and a second face. The first face is adjacent or continuous to the second face. The conductor is provided inside and/or on a surface of the element body. The outer electrode is electrically connected to the conductor. The outer electrode includes a first base electrode layer, a second base electrode layer, and a metal layer. The first base electrode layer is formed on the first face of the element body. The second base electrode layer is formed on the second face of the element body and at least partly spaced apart from the first base electrode layer. The metal layer continuously covers the first base electrode layer and the second base electrode layer.