An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

A multi-chip isolation (ISO) device package includes a leadframe including leads, an interposer substrate including a top copper layer and a bottom metal layer, with a dielectric layer in-between. A first IC die and a second IC die include circuitry including a transmitter or a receiver, and first and second bond pads are both attached top side up in the package. A laminate transformer is attached to the top copper layer positioned lateral to the IC die. Bondwires wirebond the first bond pads to first pads on the laminate transformer and to a first group of the leads or the lead terminals, and bondwires wirebond the second bond pads to second pads on the laminate transformer and to a second group of the leads or the lead terminals. A mold compound provides encapsulation.

A power conditioning device reduces capacitive-in-nature, out of phase current (verses voltage), non-linear distortion, and/or leading power factor “noise” in electrical current in an electrical panel, improving the power efficiency of devices connected to the panel. The physical and electrical specifications of the device allow it to be more easily installed and give it a more robust installation environment.

In an electronic device that employs high-speed differential signaling on one or more pairs of conductors in a flexible printed circuit, RF chokes are placed in the differential signal path and mounted directly on the flexible printed circuit which is used to interconnect a peripheral device, such as an image sensor, through a connector to another device component such as a main printed circuit board. The RF chokes are configured to suppress common-mode noise propagating in the differential pairs of conductors. In one illustrative embodiment, the RF chokes are located on the flexible printed circuit adjacent to the peripheral device to suppress common-mode noise near its source. In another illustrative embodiment, the RF chokes are mounted adjacent to the connector to suppress the common-mode noise before it has an opportunity to escape the flexible printed circuit at the major discontinuity presented by the connector.

A cover and an electronic device are described including the same. The cover includes a center area, a slit, and an inductance part. The center area is disposed on a plate of the cover. The slit is connected to the center area. The inductance part surrounds the center area defined by the slit.

A mechanical and electrical connection system including a printed circuit board, a busbar and an electrical component, wherein the board includes a first orifice in which a bottom foot of the bar is received and includes a second orifice in which a lug of the component is received, and wherein the bar includes an elastically deformable clamp which receives the lug of the component.

A power supply circuit includes a DC-DC converter and a choke coil. The choke coil includes a pair of coils wound in mutually opposite directions, and the coils are connected between a DC power source and the DC-DC converter. In the choke coil, a self-resonating frequency in a common mode is higher than a self-resonating frequency in a normal mode. In the choke coil, a normal mode impedance at the highest frequency in an AM band is higher than a common mode impedance at the lowest frequency in an FM band.

A voltage/current probe includes: a circuit board; a first inductor that is located on the circuit board, that is wound in a first direction, and that includes: a first end connected to a first output conductor; and a second end; a second inductor that is located on the circuit board, that is wound in a second direction that is opposite the first direction, and that includes: a third end that is connected to a second output conductor; and a fourth end that is connected to the second end of the first inductor and to a third output conductor.

A transformer assembly includes a top core, a bottom core under the top core, a primary winding that is multi-layered and that extends around each of the top core and the bottom core, and a secondary winding that is multi-layered and that extends around each of the top core and the bottom core. The primary winding extends around the top core and the bottom core such that, when current flows in the primary winding, magnetic flux is canceled or substantially canceled in a region between the top core and the bottom core. A converter assembly includes the transformer assembly, a primary-side circuit including the primary windings, and a secondary-side circuit including the secondary windings.

A surface-mount passive component includes a passive element and a size conversion unit on which the passive element is mounted. The size conversion unit has a body, a plurality of first external terminals each of which is exposed on an element mount surface of the body and is electrically connected to a corresponding one of passive element external terminals of the passive element, a plurality of second external terminals exposed on a board-side mount surface of the body, and connection wires that electrically connect the first external terminals and the second external terminals. An area of the board-side mount surface is larger than an area of a first main surface of the passive element, and a total area of the plurality of second external terminals on the board-side mount surface is larger than a total area of the passive element external terminals on the first main surface.