The invention comprises an inverter/converter yielding high frequency harmonics and/or non-sixty Hertz output coupled to a high frequency inductor-capacitor filter apparatus. For example, an inverter/converter apparatus is provided that uses a silicon carbide transistor to output power having a carrier frequency modulated by a fundamental frequency and a set of harmonic frequencies, where the minimum carrier frequency is above that usable by an iron-steel inductor, such as greater than ten kiloHertz at fifty or more amperes. An inductor-capacitor filter, comprising an inductor having a distributed gap core material, receives power output from the inverter/converter and processes the power by passing the fundamental frequency while reducing amplitude of the harmonic frequencies.

An inductor includes a winding that has a predefined inductance, a soft magnetic winding core, and a housing that has a cooling surface for discharging heat from the inductor. This housing encases the winding.

An object is to improve a core and heat radiation properties from the coil, and to reduce the size of a transformer. In order to attain the object described above, a transformer includes a bobbin wound around with a coil, a columnar core center portion in which the bobbin is mounted, and a plurality of core leg portions joining both ends of the core center portion on the outside of the coil. The size of the core leg portion is larger than the size of the other core leg portions, and the core leg portion includes a flat outer circumferential surface approximately parallel to a surface which is tangent to an outer circumferential side surface of the coil. The transformer is disposed in a housing such that the outer circumferential surface of the core leg portion is tangent to a floor surface of the housing.

The present invention discloses a frame device of iron core of static electrical machine having outwardly-extended heat dissipation fin and/or heat dissipation hole, in which a frame device is formed with an outwardly-extended heat dissipation fin structure and/or formed with heat dissipation holes at locations defined on adjacent surfaces between the frame device and an iron core with magnetic loops, so that the heat dissipation hole can be served to enlarge the heat dissipation area, directly exposed to an ambient gaseous or liquid environment, of the iron core with the magnetic loops of a static electrical machine, and the outwardly-extended heat dissipation fin structure can be served to enlarge the heat dissipation area to the exterior, thereby allowing the heat dissipation performance of the iron core with the magnetic loops, clamped and fastened by the frame device, to the gaseous or liquid environment to be further enhanced.

The invention comprises an inductor, such as used in processing transmission of a 3-phase power system. The inductor comprises a flat/rectangular winding with a narrow edge of the flat winding wound around a core, where the width of the winding exceeds three times the height of the inductor facing edge of the winding. The inductor optionally comprises a distributed gap particle core and/or is wound in parallel with multiple windings. Optionally, the inductor is used as part of an equal coupling common mode electrical system for processing the 3-phase transmission and/or a high frequency inverter comprising a switching device, such as a silicon carbide metal-oxide-semiconductor field-effect transistor.

A high frequency inductor filter cooling apparatus, method of manufacture, and method of use thereof is described. In one embodiment, an inductor is potted in an epoxy-silica mixture to facilitate thermal transfer from the inductor. The inductor is optionally used with a capacitor to filter/invert/convert power. The inductor optionally comprises a distributed gap core and/or a powdered core material. In one example, a minimum carrier frequency used with the filter is above that usable by a traditional wound iron-steel inductor, such as greater than seven hundred or ten thousand Hertz at fifty or more amperes. Optionally, the inductor is used in an inverter/converter apparatus in conjunction with a notched low-pass filter, a low pass filter combined with a notch filter and a high frequency roll off filter, and/or one or more of a silicon carbide, gallium arsenide, and/or gallium nitride based transistor.

Embodiments include a microelectronic device package structure having an inductor at least partially embedded within a substrate. At least one thermal solution structure may be on a surface of the inductor, and may be thermally coupled with the inductor. The one or more thermal solution structures provide a thermal pathway for cooling for the inductor, and extend a thermal time constant of the inductor.

The invention comprises an inductor, such as used in processing transmission of a 3-phase power system. The inductor comprises a flat/rectangular winding with a narrow edge of the flat winding wound around a core, where the width of the winding exceeds three times the height of the inductor facing edge of the winding. The inductor optionally comprises a distributed gap particle core and/or is wound in parallel with multiple windings. Optionally, the inductor is used as part of an equal coupling common mode electrical system for processing the 3-phase transmission and/or a high frequency inverter comprising a switching device, such as a silicon carbide metal-oxide-semiconductor field-effect transistor.

An air core type reactor unit, includes a first insulating plate which is provided with a first insulating spacer on one side, a first ferromagnetic member metal plate fixed to an insulating plate, two or more air core coils each having an air core part and formed of coil layers with the separation of an air gap, a second insulating plate, which is provided with a second insulating spacer on another side thereof and has a width smaller than an inside diameter of the coil, to incorporate more air into, a second ferromagnetic member metal plate fixed to an insulating plate, and an insulating stick passing through the air core part of the air core coils, wherein the air core coils are arranged in parallel, and held and fixed between the first insulating plate and the second insulating plate through the first insulating spacer and the second insulating spacer.

Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.