An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.

Embodiments include a microelectronic device package structure having an inductor at least partially embedded within a substrate. At least one thermal solution structure may be on a surface of the inductor, and may be thermally coupled with the inductor. The one or more thermal solution structures provide a thermal pathway for cooling for the inductor, and extend a thermal time constant of the inductor.

A stacked electronic structure, comprising a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

A stacked electronic structure, comprising a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

A coil device is installed on an installation object. The coil device includes a housing accommodating at least a coil portion and a heat radiation member coming into thermal contact with the installation object. The heat radiation member includes a main body portion interposed in at least a part of a space between the housing and the installation object and a protrusion protruding from the main body portion toward the installation object.

A coil device is installed on an installation object. The coil device includes a housing accommodating at least a coil portion and a heat radiation member coming into thermal contact with the installation object. The heat radiation member includes a main body portion interposed in at least a part of a space between the housing and the installation object and a protrusion protruding from the main body portion toward the installation object.

A radiator for cooling a transformer, preferably a power transformer, or a choke, includes a plurality of plate-shaped radiator elements which are disposed parallel to one another and through which a coolant can flow in parallel. At least one elastically deformable element is provided at least between two adjacent radiator elements and is constructed in such a way that it counteracts an expansion of the radiator elements perpendicular to the surface of the radiator elements. Plastic deformation of the walls of the radiator elements can be prevented by the elastically deformable elements. A unit including a transformer or a choke and a method for producing a radiator are also provided.

A radiator for cooling a transformer, preferably a power transformer, or a choke, includes a plurality of plate-shaped radiator elements which are disposed parallel to one another and through which a coolant can flow in parallel. At least one elastically deformable element is provided at least between two adjacent radiator elements and is constructed in such a way that it counteracts an expansion of the radiator elements perpendicular to the surface of the radiator elements. Plastic deformation of the walls of the radiator elements can be prevented by the elastically deformable elements. A unit including a transformer or a choke and a method for producing a radiator are also provided.

A planar transformer may include a primary printed circuit board (PCB) having at least a hole in which a first core and a second core are inserted and including a coil pattern, a secondary PCB having at least a hole in which the first core and the second core are inserted and including a coil pattern, and a heat dissipation plate disposed between the primary PCB and the secondary PCB and including at least a hole in which the first core and the second core are inserted.

A planar transformer may include a primary printed circuit board (PCB) having at least a hole in which a first core and a second core are inserted and including a coil pattern, a secondary PCB having at least a hole in which the first core and the second core are inserted and including a coil pattern, and a heat dissipation plate disposed between the primary PCB and the secondary PCB and including at least a hole in which the first core and the second core are inserted.