Patent classifications
H01F27/22
Noise suppressing assemblies
Assemblies having multi-functionalities of any combination of heat spreading, absorption of stray radiation, signal focusing, and shielding are provided. The assemblies may include a heat spreading layer of at least one sheet of a compressed particles of exfoliated graphite, graphitized polymers and combinations thereof. The assemblies may also include at least one magnetic layer, which may provide the benefits of magnetic flux management and/or stray radiation absorption. The assemblies may include an optional plastic coating on one or both of the exterior surfaces. The assemblies may be used to enable fast wireless charging of electronic devices by efficiently focusing magnetic flux for better power transmission efficiency.
Reactor and method for producing the same
An art includes a core part 10 provided with central leg parts 13A, 13B and right and left leg parts 11A, 11B, 12A, 12B arranged on both sides of the central leg parts 13A, 13B; a coil part 20 formed by winding a conducting wire around a circumference of the central leg parts 13A, 13B; and a heat transfer sheet 30 for dissipating heat in the coil part 20 to outside, in which the coil part 20 is configured in such a manner that a rectangular wire is wound around the circumference of the central leg parts by edgewise winding and a circumference of the coil part 20 wound therearound is abutted on the heat transfer sheet 30.
Reactor and method for producing the same
An art includes a core part 10 provided with central leg parts 13A, 13B and right and left leg parts 11A, 11B, 12A, 12B arranged on both sides of the central leg parts 13A, 13B; a coil part 20 formed by winding a conducting wire around a circumference of the central leg parts 13A, 13B; and a heat transfer sheet 30 for dissipating heat in the coil part 20 to outside, in which the coil part 20 is configured in such a manner that a rectangular wire is wound around the circumference of the central leg parts by edgewise winding and a circumference of the coil part 20 wound therearound is abutted on the heat transfer sheet 30.
Preemptive thermal mitigation for wireless power systems
The present application relates to an apparatus which comprises a wireless power transfer (WPT) system. This system comprises features which allow it to transfer more power wirelessly at extended distances than other systems operating in the same frequency range. The system possesses heat dissipation features; these features allow it to operate effectively in elevated-temperature environments, and to transfer power at higher levels and/or greater distances than a typical power-transfer system. The system also might include design features to withstand mechanical shocks, stresses, and impacts for use in a rugged environment. The system can also comprise adaptations to reduce electromagnetic interference (EMI), and can comprise specially shaped components with magnetic/ferrimagnetic properties that enhance performance. Other potential features include power conditioning by combining, within one circuit or one board, multiple elements that protect against excessive current, over-voltage, and/or reverse voltage. Other features might include integration of an antenna and a battery within one module.
Preemptive thermal mitigation for wireless power systems
The present application relates to an apparatus which comprises a wireless power transfer (WPT) system. This system comprises features which allow it to transfer more power wirelessly at extended distances than other systems operating in the same frequency range. The system possesses heat dissipation features; these features allow it to operate effectively in elevated-temperature environments, and to transfer power at higher levels and/or greater distances than a typical power-transfer system. The system also might include design features to withstand mechanical shocks, stresses, and impacts for use in a rugged environment. The system can also comprise adaptations to reduce electromagnetic interference (EMI), and can comprise specially shaped components with magnetic/ferrimagnetic properties that enhance performance. Other potential features include power conditioning by combining, within one circuit or one board, multiple elements that protect against excessive current, over-voltage, and/or reverse voltage. Other features might include integration of an antenna and a battery within one module.
REACTOR
A reactor includes an assembly of a coil and a magnetic core; a case that houses the assembly; and a sealing resin portion that seals a portion of the assembly. The reactor further includes a heat dissipation member interposed between the coil and the case. The case has an inner bottom surface and the pair of coil facing surfaces have inclined surfaces that are inclined away from each other. The coil includes a first winding portion and a second winding portion disposed opposite of the inner bottom surface with respect to the first winding portion. The first winding portion and the second winding portion are parallel with each other, and have the same width. The heat dissipation member includes a first heat dissipation portion interposed between at least one of the inclined surfaces and the second winding portion.
Thermal paths for glass substrates
Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.
Thermal paths for glass substrates
Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.
EXTERNAL WIRELESS POWER TRANSFER COIL
An external coil system for a transcutaneous energy transfer system (TETS), the external coil being configured to transfer energy sufficient to power and implantable blood pump. The system includes a housing containing the external coil, the housing includes a thermal insulating base, the external coil being partially disposed within the thermal insulating base and a thermally conductive plastic, the external coil being partially disposed within the thermally conductive plastic.
REACTOR
A reactor is provided with a coil including a pair of winding portions arranged in parallel, a magnetic core to be arranged inside and outside the winding portions, a case for accommodating an assembly including the coil and the magnetic core, a leaf spring fitting for pressing the assembly toward an inner bottom surface of the case, and a sealing resin portion to be filled into the case. Each of the winding portions is so arranged that an arrangement direction of the winding portions is along a depth direction of the case. The case includes an opening having a rectangular planar shape. The leaf spring fitting is arranged in a state curved toward the inner bottom surface by having both end parts of the leaf spring fitting directly pressed against parts of inner wall surfaces of the case facing each other in a long side direction.