Disclosed herein is an antenna device that includes a substrate; a conductor pattern formed on the substrate and including a spiral or loop-shaped antenna coil, a spiral or loop-shaped coupling coil being connected to the antenna coil and having a diameter smaller than that of the antenna coil, and a spiral-shaped booster coil at least partially overlapping the antenna coil through the substrate without being connected thereto; and a resonance capacitor connected to the booster coil. The number of turns of the booster coil is larger than that of the antenna coil.

A magnetic and electrical circuit element including magnetic-flux-conducting posts, and a multi-layer structure formed with an electrically-conductive material. The multi-layer structure includes multiple layers forming a stack of layers along a length of the posts, said multi-layer structure configured as primary and secondary windings of a transformer. The primary winding is embedded in the multi-layer structure and wound around the magnetic-flux-conducting posts in such a way that a magnetic field induced in each of the magnetic-flux-conducting posts has a magnetic field polarity opposite to a polarity of the respective magnetic field of the magnetic-flux-conducting post adjacent the respective magnetic-flux-conducting post. Around each of the magnetic-flux-conducting posts, there is a respective one of the secondary windings connected to a semiconductor device. The magnetic-flux-conducting posts are connected magnetically by continuous magnetic-flux-conducting plates, each of which is shaped to ensure a continuous flow of the magnetic field successively through adjacent magnetic-flux-conducting posts.

A magnetic and electrical circuit element including magnetic-flux-conducting posts, and a multi-layer structure formed with an electrically-conductive material. The multi-layer structure includes multiple layers forming a stack of layers along a length of the posts, said multi-layer structure configured as primary and secondary windings of a transformer. The primary winding is embedded in the multi-layer structure and wound around the magnetic-flux-conducting posts in such a way that a magnetic field induced in each of the magnetic-flux-conducting posts has a magnetic field polarity opposite to a polarity of the respective magnetic field of the magnetic-flux-conducting post adjacent the respective magnetic-flux-conducting post. Around each of the magnetic-flux-conducting posts, there is a respective one of the secondary windings connected to a semiconductor device. The magnetic-flux-conducting posts are connected magnetically by continuous magnetic-flux-conducting plates, each of which is shaped to ensure a continuous flow of the magnetic field successively through adjacent magnetic-flux-conducting posts.

One object is to lessen the difference between the direction of the magnetic flux and the easy direction of magnetization in a coil element and improve the effective permeability of the coil element. A coil element according to one element of the present invention includes: a coil conductor wound around a coil axis; at least one isotropic magnetic material layer provided on at least one of an upper surface and a lower surface of the coil conductor, the at least one isotropic magnetic material layer being made of an isotropic magnetic material; and at least one anisotropic magnetic material layer provided on an opposite surface of the at least one isotropic magnetic material layer to the coil conductor, the at least one anisotropic magnetic material layer being made of an anisotropic magnetic material having an easy direction of magnetization oriented perpendicular to the coil axis.

A laser-scribed grain-oriented silicon steel resistant to stress-relief annealing and a manufacturing method therefor. Parallel linear grooves (20) are formed on one or both sides of grain-oriented silicon steel (10) by laser etching. The linear grooves (20) are perpendicular to, or at an angle to, the rolling direction of the steel plate. A maximum height of edge protrusions of the linear grooves (20) does not exceed 5 μm, and a maximum height of spatters in etch-free regions between adjacent linear grooves (20) does not exceed 5 μm, and the proportion of an area occupied by spatters in the vicinity of the linear grooves (20) does not exceed 5%. The steel has low manufacturing costs, and the etching effect of the finished steel is retained during a stress-relief annealing process. The steel is suitable for manufacturing of wound iron core transformers.

A laser-scribed grain-oriented silicon steel resistant to stress-relief annealing and a manufacturing method therefor. Parallel linear grooves (20) are formed on one or both sides of grain-oriented silicon steel (10) by laser etching. The linear grooves (20) are perpendicular to, or at an angle to, the rolling direction of the steel plate. A maximum height of edge protrusions of the linear grooves (20) does not exceed 5 μm, and a maximum height of spatters in etch-free regions between adjacent linear grooves (20) does not exceed 5 μm, and the proportion of an area occupied by spatters in the vicinity of the linear grooves (20) does not exceed 5%. The steel has low manufacturing costs, and the etching effect of the finished steel is retained during a stress-relief annealing process. The steel is suitable for manufacturing of wound iron core transformers.

Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

A transformer core, comprising a first yoke, a second yoke, a column (6) having a column main axis (8) and extending between the first yoke and the second yoke, and an elongate clamping structure (10) comprising an elongate rigid member (12) having a rigid member main axis (14) is provided. The column (6) includes an elongate opening (16) having an opening main axis (18) which is oriented transversal with respect to the column main axis (8). The rigid member (12) is positioned within the elongate opening (16) such that the rigid member main axis (14) is oriented parallel to the opening main axis (18).

An adhesively-laminated core includes: a plurality of electrical steel sheets which are stacked on each other and of which both surfaces are coated with an insulation coating; and an adhesion part which is provided between the electrical steel sheets adjacent to each other in a stacking direction and adheres the electrical steel sheets to each other, wherein an adhesive forming the adhesion part contains an organic resin and an inorganic filler, wherein a 50% particle size of the inorganic filler is 0.2 to 3.5 μm, wherein a 90% particle size of the inorganic filler is 10.0 μm or less, and wherein an amount of the inorganic filler is 5 to 50 parts by mass with respect to 100 parts by mass of the organic resin.

An adhesively-laminated core includes: a plurality of electrical steel sheets which are stacked on each other and of which both surfaces are coated with an insulation coating; and an adhesion part which is provided between the electrical steel sheets adjacent to each other in a stacking direction and adheres the electrical steel sheets to each other, wherein an adhesive forming the adhesion part contains an organic resin and an inorganic filler, wherein a 50% particle size of the inorganic filler is 0.2 to 3.5 μm, wherein a 90% particle size of the inorganic filler is 10.0 μm or less, and wherein an amount of the inorganic filler is 5 to 50 parts by mass with respect to 100 parts by mass of the organic resin.