A method for manufacturing a non-circular wound magnetic core composed of a nano-crystallized soft magnetic alloy thin strip comprises: a step for acquiring a multilayer body by winding a soft magnetic alloy thin strip; a step for nano-crystallizing the soft magnetic alloy thin strip by inserting a heat treatment inner peripheral jig to the inner peripheral side of the multilayer body, maintaining the multilayer body in a non-circular shape, and subjecting the multilayer body to a heat treatment; and a step for maintaining the nano-crystallized multilayer body in the non-circular shape by using outer and inner peripheral jigs and impregnating resin between the layers of the multilayer body. The resin impregnation inner and outer peripheral jigs are shaped so as to not contact the inner peripheral surface and/or the outer peripheral surface of the multilayer body at a part where the multilayer body has a large degree of curvature.

A method for manufacturing a non-circular wound magnetic core composed of a nano-crystallized soft magnetic alloy thin strip comprises: a step for acquiring a multilayer body by winding a soft magnetic alloy thin strip; a step for nano-crystallizing the soft magnetic alloy thin strip by inserting a heat treatment inner peripheral jig to the inner peripheral side of the multilayer body, maintaining the multilayer body in a non-circular shape, and subjecting the multilayer body to a heat treatment; and a step for maintaining the nano-crystallized multilayer body in the non-circular shape by using outer and inner peripheral jigs and impregnating resin between the layers of the multilayer body. The resin impregnation inner and outer peripheral jigs are shaped so as to not contact the inner peripheral surface and/or the outer peripheral surface of the multilayer body at a part where the multilayer body has a large degree of curvature.

Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

In a magnetic core including a laminated core in which multiple core thin strips are laminated, the magnetic core includes a cutting mark region formed by cutting tie sticks 212, connected to the core thin strips 511, in a lamination direction of the core thin strips 511, and the cutting mark region 51C is positioned on an inner side than outer peripheries of the core thin strips 511. The core thin strip 511 may include a portion made of a nanocrystal-containing alloy material that is obtained by nano-crystallizing an amorphous alloy material with heat treatment.

In a magnetic core including a core assembly having a structure that multiple thin strip blocks are arranged, the thin strip blocks being formed of multiple laminates of nanocrystalline thin strips made of a nanocrystal-containing alloy material, the thin strip block includes a fixedly joined portion in which the nanocrystalline thin strips adjacent to each other in a lamination direction are fixedly joined together. The fixedly joined portion may include side surfaces of the nanocrystalline thin strips and may be a laser welded portion.

In a magnetic core including a core assembly having a structure that multiple thin strip blocks are arranged, the thin strip blocks being formed of multiple laminates of nanocrystalline thin strips made of a nanocrystal-containing alloy material, the thin strip block includes a fixedly joined portion in which the nanocrystalline thin strips adjacent to each other in a lamination direction are fixedly joined together. The fixedly joined portion may include side surfaces of the nanocrystalline thin strips and may be a laser welded portion.

An Fe—Si—B—C-based amorphous alloy ribbon as thick as 20-30 μm having a composition comprising 80.0-80.7 atomic % of Fe, 6.1-7.99 atomic % of Si, and 11.5-13.2 atomic % of B, the total amount of Fe, Si and B being 100 atomic %, and further comprising 0.2-0.45 atomic % of C per 100 atomic % of the total amount of Fe, Si and B, except for inevitable impurities has a stress relief degree of 92% or more.

An Fe—Si—B—C-based amorphous alloy ribbon as thick as 20-30 μm having a composition comprising 80.0-80.7 atomic % of Fe, 6.1-7.99 atomic % of Si, and 11.5-13.2 atomic % of B, the total amount of Fe, Si and B being 100 atomic %, and further comprising 0.2-0.45 atomic % of C per 100 atomic % of the total amount of Fe, Si and B, except for inevitable impurities has a stress relief degree of 92% or more.

A wireless power receiving apparatus which wirelessly charges power according to one embodiment of the present invention includes a substrate, a soft magnetic layer which is laminated on the substrate and is formed with a plurality of patterns including at least 3 lines radiated from predetermined points, and a coil which is laminated on the soft magnetic layer and receives electromagnetic energy radiated from a wireless power transmitting apparatus.

A wireless power receiving apparatus which wirelessly charges power according to one embodiment of the present invention includes a substrate, a soft magnetic layer which is laminated on the substrate and is formed with a plurality of patterns including at least 3 lines radiated from predetermined points, and a coil which is laminated on the soft magnetic layer and receives electromagnetic energy radiated from a wireless power transmitting apparatus.