H01F27/255

Coil electronic component

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.

Soft magnetic powder, powder magnetic core, magnetic element, and electronic device

A soft magnetic powder of the invention has a composition represented by Fe.sub.100-a-b-c-d-e-fCu.sub.aSi.sub.bB.sub.cM.sub.dM′.sub.eX.sub.f (at %) [wherein M is Nb, W, Ta, Zr, Hf, Ti, or Mo, M′ is V, Cr, Mn, Al, a platinum group element, Sc, Y, Au, Zn, Sn, or Re, X is C, P, Ge, Ga, Sb, In, Be, or As, and a, b, c, d, e, and f are numbers that satisfy the following formulae: 0.1≤a≤3, 0<b≤30, 0<c≤25, 5≤b+c≤30, 0.1≤d≤30, 0≤e≤10, and 0≤f≤10], wherein a crystalline structure having a particle diameter of 1 nm or more and 30 nm or less is contained in an amount of 40 vol % or more, and the difference in the coercive force of the powder after classification satisfies predetermined conditions.

Soft magnetic powder, powder magnetic core, magnetic element, and electronic device

A soft magnetic powder of the invention has a composition represented by Fe.sub.100-a-b-c-d-e-fCu.sub.aSi.sub.bB.sub.cM.sub.dM′.sub.eX.sub.f (at %) [wherein M is Nb, W, Ta, Zr, Hf, Ti, or Mo, M′ is V, Cr, Mn, Al, a platinum group element, Sc, Y, Au, Zn, Sn, or Re, X is C, P, Ge, Ga, Sb, In, Be, or As, and a, b, c, d, e, and f are numbers that satisfy the following formulae: 0.1≤a≤3, 0<b≤30, 0<c≤25, 5≤b+c≤30, 0.1≤d≤30, 0≤e≤10, and 0≤f≤10], wherein a crystalline structure having a particle diameter of 1 nm or more and 30 nm or less is contained in an amount of 40 vol % or more, and the difference in the coercive force of the powder after classification satisfies predetermined conditions.

WIRELESS POWER RECEIVING DEVICE FOR ELECTRIC VEHICLE
20220416574 · 2022-12-29 ·

A wireless power receiving device for an electric vehicle is provided. A wireless power receiving device for an electric vehicle, according to an exemplary embodiment of the present invention, comprises: a wireless power receiving coil for receiving wireless power to be transmitted from the outside; a coil support member which has a position fixing means formed at a position corresponding to the wireless power receiving coil so as to fix the wireless power receiving coil, and which is made of a material including a magnetic substance so as to shield the magnetic field; a ferrite core including a plurality of ferrite block bodies which have predetermined areas and which are arranged on one surface of the coil support member so as to be adjacent to each other; and a plate-shaped metal plate for covering one surface of the ferrite core by having a predetermined area.

ELECTRONIC COMPONENT

An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.

ELECTRONIC COMPONENT

An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.

METHOD OF FORMING A CAST INDUCTOR APPARATUS
20220415563 · 2022-12-29 ·

The invention comprises a method for manufacturing an inductor, comprising the steps of: casting a first cast winding section; casting a second cast winding section; and mechanically coupling the first cast winding section to the second cast winding section to form a section of a winding about a core of the inductor. Optionally, a first end of a connector section is welded to the first cast winding section and a second end of the connector section is welded to the second cast winding section, where the first and second cast winding sections have a common cast shape.

METHOD OF FORMING A CAST INDUCTOR APPARATUS
20220415563 · 2022-12-29 ·

The invention comprises a method for manufacturing an inductor, comprising the steps of: casting a first cast winding section; casting a second cast winding section; and mechanically coupling the first cast winding section to the second cast winding section to form a section of a winding about a core of the inductor. Optionally, a first end of a connector section is welded to the first cast winding section and a second end of the connector section is welded to the second cast winding section, where the first and second cast winding sections have a common cast shape.

Method of manufacturing a power semiconductor system

A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

Method of manufacturing a power semiconductor system

A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.