A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.

Presented is a combo antenna module for preventing shadowing of a short-range communication antenna by forming a loop pattern, for short-range communication, in an inner circumferential region of a wireless power transmission antenna. The presented combo antenna module comprises a radiation pattern for wireless power transmission and a radiation pattern for short-range communication, which are disposed on a base substrate, wherein the transverse paths for entry and exit are made different for the radiation pattern for short-range communication so as to form a loop pattern in the inner area of the radiation pattern for wireless power transmission.

A coil component includes a body; an insulating substrate embedded in the body; and a coil portion disposed on at least one surface of the insulating substrate. The insulating substrate is inclined with respect to one surface of the body, in a cross-section of the body in a width-thickness direction.

A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.

A coil component including an element assembly that includes a support substrate having a cavity, a first coil disposed on a first principal surface of the support substrate, a second coil disposed on a second principal surface of the support substrate, and a magnetic portion. The coil component further includes first and second outer electrodes electrode electrically coupled to the first coil, and third and further outer electrodes electrically coupled to the second coil. Each outer electrode is disposed on the surface of the element assembly. The cavity of the support substrate, the core portion of the first coil, and the core portion of the second coil overlap at least one another when viewed in the direction perpendicular to the principal surface. The magnetic portion is disposed in at least the cavity and the two core portions. Also, the support substrate is formed of sintered ferrite.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and first and second outer electrodes that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover parts of first and second end surfaces and parts of a first main surface. The length of a region in which the coil conductors are arranged in the stacking direction lies in a range from 85% to 95% of the length of the multilayer body. The sum of the numbers of stacked coil conductors that face the parts of the first and second outer electrodes extending along the first main surface is less than or equal to twelve.

A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

The present invention relates to an electrical resonator (10), and an array (30) comprising a plurality of the electrical resonators (10). The electrical resonator (10) comprises an inductor coil comprising at least one turn. The at least one turn comprises an outer turn defining an outer coil perimeter (14). The electrical resonator comprises at least one capacitor connected to the inductor coil. The outer coil perimeter (14) comprises four major edges (141). Each of the major edge (141) is substantially linear and arranged on a different edge of a quadrilateral. The outer coil perimeter (14) comprises four minor edges (142) connecting the major edges (141). The array (30) comprises a first plurality of the electrical resonators (10a) arranged in a first layer, and a second plurality of the electrical resonators (10b) arranged in a second layer on top of the first layer. The minor edge (142a) of each electrical resonator substantially abuts the minor edge (142b) of an adjacent electrical resonator in the same layer, and the first and second layer together define a quadrilateral array of the electrical resonators (30), with a centre of each inductor coil in the first layer coincident with the centre of a gap region between inductor coils in the second layer. A method of arranging a plurality of electrical resonators in an array is also disclosed.

A thin film inductor is provided. The thin film inductor includes a first coil assembly, a first magnetic layer, and a second magnetic layer. The first coil assembly includes a first substrate and two first electrically conductive circuits respectively arranged on two surfaces of the first substrate that are opposite to each other. The first magnetic layer and the second magnetic layer are respectively arranged on the two surfaces of the first substrate that are opposite to each other, and the two first electrically conductive circuits are respectively embedded in the first magnetic layer and the second magnetic layer. The first substrate has a first non-circuit layout, and the first electrically conductive circuit is arranged around the first non-circuit layout. A ratio between an area of the first non-circuit layout and an area of the first substrate is 0.1 or more.

Techniques and mechanisms for providing structures of a magnetic material based inductor. In an embodiment, an inductor comprises a body of a magnetic material, and a conductor which extends along a surface of the body. The body comprises a carrier material and magnetic filler particles distributed in the carrier material. A passivation material of the inductor is provided adjacent to the conductor and to surfaces of the filler particles. The conductor and the passivation material comprise different respective material compositions, wherein the passivation material comprises one of nickel, tin, copper, palladium, or gold. In another embodiment, the inductor is one of a plated through hole inductor type of a planar inductor type.