A magnetic element includes a first magnetic column, a second magnetic column, a first winding wound around the first magnetic column, and a second winding wound around the second magnetic column. The first winding includes a first horizontal winding, a second horizontal winding, a first vertical winding, and a second vertical winding. The second winding includes a third horizontal winding, a fourth horizontal winding, a third vertical winding, and a fourth vertical winding. The first vertical winding and the third vertical winding are disposed on or in a first circuit board and a second circuit board respectively, the second vertical winding and the fourth vertical winding are disposed on or in a third circuit board. The first circuit board, the first magnetic column, the third circuit board, the second magnetic column, and the second circuit board are sequentially bonded to form a pre-package.

A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

A coil component includes a body and external electrodes. The body includes a support member having through-openings formed in end portions thereof, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil. The through-openings are filled with end portions of the internal coil. An insulating layer is interposed between the internal coil and the external electrode.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

A coil component includes a body having one surface and another surface opposing each other in one direction, an internal insulating layer embedded in the body, and a coil portion disposed on the internal insulating layer and forming at least one turn. First and second external electrodes are disposed on the one surface of the body to be spaced apart from each other, and first and second connection electrodes respectively penetrate through the body to connect the coil portion and the first and second external electrodes to each other. A support electrode extends from the coil portion to be exposed to the other surface of the body to support the coil portion and the internal insulating layer.

An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.

The present specification discloses a pulsed electromagnetic field system having planar microcoil arrays integrated into clothing. Each of the planar microcoil arrays has two or more planar microcoils positioned on a flexible substrate. The planar microcoil arrays are connected to a controller configured to generate an electrical current and transmit that electrical current, in accordance with a particular stimulation protocol, to each of the planar microcoil arrays.

An electronic device includes a magnetic assembly with a multilevel lamination or metallization structure having a core layer, dielectric layers and conductive features formed in metal layers on or between the dielectric layers in respective planes of orthogonal first and second directions and stacked along an orthogonal third direction. The conductive features include first and second patterned conductive features forming first and second windings, first and second conductive capacitor plates, and first and second conductive field plates, in which the first conductive capacitor plate is between the first conductive field plate and the core layer along the third direction and the second conductive capacitor plate is between the second conductive field plate and the core layer along the third direction.

Disclosed herein are a transformer and a method of manufacturing the same. The transformer includes: a primary side winding having a loop shape; a secondary side winding formed on the same plane as that of the primary side winding in a remaining section except for at least a section at which it intersects with the primary side winding and having the same loop shape as that of the primary side winding so as to be electromagnetically coupled to the primary side winding; and an intersecting section formed so that the primary side and secondary side windings having the sum of the turn numbers of 3 or more intersect with each other in a two-layer structure, wherein the intersecting section includes at least one point of intermediate node having one side connected in a first layer and the other side connected in a second layer.

One object is to suppress thermal shrinkage of a cover resin layer at the time of thermal curing. A laminated coil according to one embodiment of the present invention is provided with a magnetic substrate formed of a sintered magnetic material, an insulation resin layer formed on the magnetic substrate, a cover resin layer formed on the insulation resin layer, and a coil conductor embedded in the insulation resin layer. In one embodiment of the present invention, said insulation resin layer includes a first resin and first filler particles, and said cover resin layer includes a second resin and second filler particles. A filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer.