A coil component includes a body having both end surfaces opposing each other in a length direction; a support substrate disposed in the body; a coil portion disposed on the support substrate in a width direction of the body, and including first and second lead-out portions each exposed to a first surface and a second surface of the body opposing each other in a thickness direction of the body, respectively, and disposed on the support substrate; and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to one ends of the first and second lead-out portions exposed to the first surface of the body, respectively.

An inductive device is provided. The inductive device includes a laminated body and two external electrodes. The laminated body includes an insulator and a plurality of conductive wiring layers stacked in a first direction. The conductive wiring layers are embedded within the insulator, and any two adjacent ones of the conductive wiring layers are electrically connected to each other to form a coiled conductor extending spirally. The external electrodes are disposed on the laminated body and electrically connected to the coiled conductor, and the external electrodes are spaced apart from each other. Each of the external electrodes includes a base plate, a lateral wall, and a plurality of stress dispersing structures extending toward the coiled conductor and protruding from at least one of the base plate and the lateral wall, and the stress dispersing structures are spaced apart from each other and engaged with the laminated body.

A printed circuit board of a planar transformer includes a first column hole, a second column hole, and a plurality of winding layers. At least one of the winding layers includes a first winding and a second winding connected in series. The first winding surrounds the first column hole and has a first opening direction. The second winding surrounds the second column hole and has a second opening direction. The first opening direction is different from the second opening direction. Consequently, the windings on the plurality of layers may be connected in series through conductive holes of the PCB to increase the number of winding turns.

An inductor device includes an inductor element, a substrate and a ground plane is disclosed. The ground plane includes several sub ground planes. The inductor element is set above the substrate, and the substrate is set above the ground plane. When at least one of several connection relationships between the several sub ground planes change, an inductance value of the inductor element changes.

An electronic component comprises a magnetic substrate, a multilayer body including a plurality of insulator layers, and a plurality of coils extending inside the multilayer body. When a first magnetic substrate is viewed toward a third positive direction, an outer edge of the first magnetic substrate includes a linear side. Also, a cutout is recessed inward from the side. When a direction along the side is taken as a first direction and a direction perpendicular to the first direction is taken as a second direction when the first magnetic substrate is viewed toward the third positive direction, a maximum dimension of the cutout in the first direction is different from a maximum dimension of the cutout in the second direction.

A transformer device includes a first trace and a second trace. The first trace includes at least one first sub-trace. The at least one first sub-trace is located on a first layer. The second trace includes at least one second sub-trace and a third sub-trace. The at least one second sub-trace is located on the first layer, and disposed adjacent to the least one first sub-trace. The third sub-trace is located on a second layer, and overlaps the at least one first sub-trace partially.

An inductor structure, a package substrate, an integrated circuit device, an integrated circuit device assembly and a method of fabricating the inductor structure. The inductor structure includes: an electrically conductive body; and a magnetic structure including a non-electrically-conductive magnetic material, wherein: one of the magnetic structure or the electrically conductive body wraps around another one of the magnetic structure or the electrically conductive body to form the inductor structure therewith; and at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another.

There is provided a semiconductor device including: a circuit region formed on a semiconductor substrate; a first insulating film covering at least a portion of a region on the semiconductor substrate that includes an upper portion of the circuit region; redistribution wiring disposed on the first insulating film; a coil formed by the redistribution wiring on the first insulating film, the coil being connected to the circuit region; a first soft magnetic material film disposed in an aperture portion of the first insulating film, the aperture portion being provided at a lower portion of the coil; and a second soft magnetic material film that is disposed on the first soft magnetic material film, the second soft magnetic material film covering at least a portion of the coil.

In a described example, an apparatus includes a transformer including: an isolation dielectric layer with a first surface and a second surface opposite the first surface; a first inductor formed over the first surface, the first inductor comprising a first layer of ferrite material, and a first coil at least partially covered by the first layer of ferrite material; and a second inductor formed over the second surface, the second inductor comprising a second layer of ferrite material and a second coil at least partially covered by the second layer of ferrite material.

A semiconductor device includes: a first semiconductor chip including a first coil that generates a magnetic field signal; a wiring board including a second coil, a third coil, and a twisted pair wiring, the second coil being disposed to face the first coil and receiving the magnetic field signal generated by the first coil, the twisted pair wiring connecting the second coil with the third coil; and a second semiconductor chip including a fourth coil disposed to face the third coil and receiving a magnetic field signal generated by the third coil.