The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.

A primary coil suitable for use in a transformer includes a primary winding bobbin onto which a layer of a primary winding and at least one layer, which includes a fixed number of 1 to 3 layers, of an interlayer insulation material are wound alternately, wherein the interlayer insulation material and the primary winding are impregnated with an epoxy, and wherein the interlayer insulation material is a nonwoven material or a crepe paper.

A transformer comprising a primary winding and a secondary winding. The primary winding has N.sub.2 number turns and having a first terminal and a second terminal. The secondary winding has having N.sub.1 fractional portions, which together form a full turn, are in close proximity to the primary winding to establish coupling between the primary winding and the N.sub.1 fractional coil portions, the transformer turn ratio from the primary winding to the secondary winding is N.sub.2:(N.sub.3/N.sub.1) where N.sub.2 is an integer equal to or greater than 1, N.sub.1 is an integer greater than or equal to 2, and N.sub.3 is an integer greater than or equal to 1. Also disclosed is a stacked integrated transformer having a primary winding and secondary winding of which one or both have a waterfall structure and a portion of which functions as a ground connected shield between the secondary winding and the primary winding.

A laminate transformer includes a multilayer substrate having at least first, second, third, and fourth metal layers. The second metal layer and the third metal layer are separated by a voltage barrier having a thickness. A first multiloop coil has at least a first loop on the first metal layer and at least a second loop on the second metal layer. A second multiloop coil has at least a third loop on the third metal layer and at least a fourth loop on the fourth metal layer. A partial EMI shield for the first multiloop coil is on the second metal layer. A partial EMI shield for the second multiloop coil is on the third metal layer.

A coil formed from a flexible polymer substrate that is printed with metal traces is disclosed in which the flexible substrate has notches that align each loop as the substrate is wound into a ring. The notches are precisely spaced so that the diameter of each loop is well controlled. As the substrate is wound, adhesive is applied along its length to fill gaps between each loop's layer. Ideally, the adhesive has a similar dielectric constant as the polymer substrate. The resulting coil has loops of metal traces separated by precise a thickness of dielectric. The precision in spacing between metal layers and dielectric allows the coil to be designed for self-resonance.

An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.

A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.

A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

An inductor includes a first wire adjacent to a second wire and separated by an interval; a first magnetic layer having first and second surfaces separated from each other by an interval, and an inner peripheral surface in contact with an outer peripheral surface of the first and second wires between the first and second surfaces; a second magnetic layer disposed on the first surface; and a third magnetic layer disposed on the second surface. The second magnetic layer has a third surface facing and separated from the first surface by an interval in the thickness direction. The relative permeability of each of the second and third magnetic layers is higher than that of the first magnetic layer. The inductor includes a suppression portion located between the first and second wires which suppresses the magnetic coupling between the first and second wires.

A coil component includes: a body having a first surface and a second surface opposing each other in one direction and including a core extending in the one direction; a coil portion embedded in the body and having at least one turn around the core; and an external electrode disposed at least on the first surface of the body and connected to the coil portion. A first distance from the coil portion to a third surface of the body is greater than a second distance from the coil portion to a fourth surface of the body. The third and fourth surfaces oppose each other and have the core disposed therebetween. Turns of the coil portion disposed between the third surface of the body and the core are more than those of the coil portion disposed between the fourth of the body and the core.