A high voltage winding for a single electrical phase of a high voltage electromagnetic induction device, wherein the high voltage winding comprises: a first winding part, and a second winding part, wherein the first winding part comprises: a first conductor, a first solid electrical insulator circumferentially enclosing the first conductor, and a first semi-conductive sheath circumferentially enclosing the first solid electrical insulator, wherein the first semi-conductive sheath is earthed or connected to an electric potential that is lower than a rated voltage of the high voltage winding, and wherein the second winding part comprises: a second conductor, and a second solid electrical insulator circumferentially enclosing the second conductor and forming an outermost layer of the second winding part.

A shield member and a power transmission unit each include a shielding wall formed annularly about an axis so as to surround a power transmission coil at a position extending along an intersecting direction. The shielding wall shields a magnetic force generated by the power transmission coil. The shielding wall is formed such that a distance between wall faces facing each other in the intersecting direction is wider at a longer distance from a first side toward a second side in an axial direction.

Embodiments disclosed herein describe a wireless power receiving system for an electronic device includes: a first inductor coil configured to receive power primarily at a first frequency and from magnetic fields propagating in a first direction; and a second inductor coil configured to receive power primarily at a second frequency and from magnetic fields propagating in a second direction, wherein the first frequency is different than the second frequency.

The present embodiment relates to a coil device and a wireless charging device including the same. The coil device according to the present embodiment includes: a coil wound to form a hollow portion; and a shielding housing including a flat part on which the coil is disposed, an inner wall corresponding to a shape of the hollow portion, and an outer wall corresponding to an outer circumferential shape of the coil. The inner wall protruding from the flat part on which the coil is disposed may have a height of 0 to 1.5 times a height of the coil. An inductance of the coil may have a range of 9.2 H to 12.26 H.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

The present invention provides a magnetic flux pad for generating or receiving magnetic flux, comprising at least three coils positioned such that the windings thereof are in substantially the same plane, and a power supply or pickup controller operable to selectively energise or receive power from two or more of the coils such that a magnetic field is produced or received by at least one of a plurality of pairs of the at least three coils. In preferred embodiments, the three or more coils are substantially mutually decoupled, overlapping, and/or equidistantly spaced from one another.

A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

Embodiments describe a wireless charging device including: a housing having a charging surface and first and second walls that define an interior cavity; a transmitter coil arrangement disposed within the interior cavity, an interconnection structure positioned within the interior cavity below the transmitter coil arrangement, the interconnection structure including a plurality of packaged electrical components mounted on the interconnection structure and configured to operate the plurality of transmitter coils during wireless power transfer, where the plurality of packaged electrical components is located below the transmitter coil arrangement; and a frame comprising a plurality of openings positioned corresponding to the plurality of packaged electrical components, each opening providing space within which a respective packaged electrical device is disposed.