A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

An electronic substrate may be fabricated having a dielectric material, metal pads embedded in the dielectric material with co-planar surfaces spaced less than one tenth millimeter from each other, and a metal trace embedded in the dielectric material and attached between the metal pads, wherein a surface of the metal trace is non-co-planar with the co-planar surfaces of the metal pads at a height of less than one millimeter, and wherein sides of the metal trace are angled relative to the co-planar surfaces of the metal pads. In an embodiment of the present description, an embedded angled inductor may be formed that includes the metal trace. In an embodiment, an integrated circuit package may be formed with the electronic substrate, wherein at least one integrated circuit devices may be attached to the electronic substrate. Other embodiments are disclosed and claimed.

A multilayer coil component that includes a multilayer body in which a plurality of insulating layers are stacked in a stacking direction and a coil inside the multilayer body, and outer electrodes that are on surfaces of the multilayer body and are electrically connected to the coil. The insulating layers include a spinel-structure ferrite phase and a ZnFe(BO.sub.3)O-type crystalline phase.

The invention comprises a method for forming an inductor, comprising the steps of: providing an inductor core and fastening at least ten sections of a winding together to form a winding, the winding comprising a formed wound shape about the inductor core. Optionally and preferably the step of fastening repeats steps of joining a member of a first set of winding parts to an element of a second set of winding parts, where the two sets of winding parts have different cast or formed shapes.

A coil component including: a body; a coil portion including first and second lead-out terminals and disposed in the body; an insulating film disposed between the coil portion and the body and containing a thermosetting resin having a vinyl group; and an external electrode portion disposed on the body and connected to each of the first and second lead-out terminals of the coil portion.

An inductor component comprising a base body comprising a filler; a coil in the base body and helically wound along an axis; and external electrodes in the base body and each electrically connected to the coil, with outer faces of the external electrodes exposed from the base body. The base body comprises external electrode contact parts that each contact one of the external electrodes on an inner side of the base body and are each disposed along one of the external electrodes; and a central part that comprises a center point of the base body and is located away from the coil, the external electrodes, and the external electrode contact parts. A content rate of the filler in the external electrode contact parts is from a 0.9-fold level to a 1.1-fold level of a content rate of the filler in the central part.

A multilayer coil component includes a multilayer body in which a plurality of insulating layers are stacked in a stacking direction and a coil inside, and outer electrodes on surfaces of the multilayer body and electrically connected to the coil. The insulating layers have a magnetic phase having spinel structure containing at least Fe, Ni, Zn, and Cu and a non-magnetic phase containing at least Si. When grain sizes D50 and D90 of crystal grains constituting the magnetic phase are respectively defined as equivalent-area circle diameters of 50% and 90% on a cumulative sum basis in a cumulative distribution of equivalent-area circle diameters of the crystal grains, the grain size D50 is from 50 nm to 750 nm, and the grain size D90 is from 200 nm to 1500 nm.

A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties. ##STR00001##

Inductor device comprising a rectangular prismatic electro-insulating support (10) with three pairs of parallel outer faces (11) defining orthogonal axis (X, Y, Z), and defining eight corners; a rectangular prismatic magnetic core (20) supported by said electro-insulating support (10); and three conductor wire windings (DX, DY, DZ) wound around the three axis (X, Y, Z) surrounding the magnetic core (20); wherein the magnetic core (20) is a hollow magnetic core (20) composed by three pairs of sheets (21), each pair of sheets (21) being composed by two parallel sheets (21) facing each other perpendicular to one of said axis (X, Y, Z), and wherein each sheet (21) is made of a magnetic material, said sheet (21) being in contact and attached to the electro-insulating support (10) and being in contact with the surrounding orthogonal sheets (21).

A multilayer coil component includes an element body including a plurality of laminated insulator layers, and a coil disposed in the element body. The coil includes a first coil conductor having a first inner diameter, a second coil conductor having a second inner diameter smaller than the first inner diameter, and a connection conductor connecting the first coil conductor and the second coil conductor. The second coil conductor is adjacent to the first coil conductor in a direction in which the plurality of insulator layers are laminated. The connection conductor has a shape along the first coil conductor and the second coil conductor.