Patent classifications
H01F2027/348
Coil Module, Wireless Charging Transmitting Apparatus, Wireless Charging Receiving Apparatus, Wireless Charging System, and Terminal
A coil module includes a first planar coil winding and a second planar coil winding. A first coil of the first planar coil winding includes a first outer side part and a first inner side part. A first coil of the second planar coil winding includes a second outer side part and a second inner side part. An end part of the first outer side part is connected to an end part of the second inner side part, and an end part of the second outer side part is connected to an end part of the first inner side part.
Method of manufacturing inductors in BEOL with particulate magnetic cores
A method for forming an inductor device. The method comprises forming a trench within a central core region of a conductive coil formed within a dielectric material. The method further comprises forming a composite region within the trench. The composite region including a polymer matrix having a plurality of particles with magnetic properties dispersed therein with the central core region to reduce eddy current loss and increase energy storage.
COIL COMPONENT
Disclosed herein is a coil component that includes a substrate having a first surface, and a first coil pattern formed on the first surface of the substrate. The first coil pattern includes a plurality of turns having an innermost turn and an outermost turn. Each of the innermost and outermost turns is radially divided into a plurality of lines. The innermost turn is greater in a number of lines than the outermost turn.
Dummy fill with eddy current self-canceling element for inductor component
A dummy fill element for positioning inside an active inductor component of an integrated circuit (IC), the inductor component, the IC and a related method, are disclosed. The active inductor component is configured to convert electrical energy into magnetic energy to reduce parasitic capacitance in an IC. The dummy fill element includes: a first conductive incomplete loop having a first end and a second end, and a second conductive incomplete loop having a first end and a second end. First ends of the first and second conductive incomplete loops are electrically connected, and the second ends of the first and second conductive incomplete loops are electrically connected. In this manner, eddy currents created in each conductive incomplete loop by the magnetic energy cancel at least a portion of each other, allowing for a desired metal fill density and maintaining the inductor's Q-factor.
A POWER CONVERTER EMBODIED IN A SEMICONDUCTOR SUBSTRATE MEMBER
A power converter is embodied on a semiconductor substrate member and has a first region with a passive electrical component with a first electrically conductive layer pattern of an electrically conductive material and a second electrically conductive layer pattern of an electrically conductive material deposited on respective sides of the semiconductor substrate member. A trench or through-hole is formed (by etching) in the substrate within the first region, and the electrically conductive material is deposited at least on a bottom portion of the trench or on a sidewall of the through-hole and electrically connected to one or both of the first conductive layer pattern and the second conductive layer pattern. A second region has an active semiconductor component integrated with the semiconductor substrate by being fabricated by a semiconductor fabrication process. There is also provided a power supply, such as a DC-DC converter, embedded the semiconductor substrate member.
High voltage cable for a winding and electromagnetic induction device comprising the same
The present disclosure relates to a cable for a high voltage winding of an electromagnetic induction device. The cable includes a conductor having a width w, and a shield arranged around at least a portion of the conductor, wherein in any cross-section of the conductor the conductor has rounded corners with a radius r in the range w/5<rw/3. A high voltage electromagnetic induction device having a cable forming a high voltage winding is also disclosed.
Magnetic flux leakage compensation structure
An embodiment provides a magnetic flux leakage compensation structure, which includes an upper clamping piece and a lower clamping piece which are electrically disconnected from side-column tension plates and electrically connected with core-column tension plates, respectively, and which are electrically connected with each other through bypass cables. According to the magnetic flux leakage compensation structure provided by the embodiment, by the bypass cables connecting the upper and lower clamping pieces, currents flowing through the side-column tension plates and cores and induced voltages caused by the magnetic flux leakage in an electric circuit may be effectively avoided.
Surface-mounted LC device
A surface-mounted LC device that includes a substrate having a first surface, multiple inductors formed on the first surface and formed respectively by multiple coiled conductor patterns, a first insulating layer covering the multiple coiled conductor patterns, and a capacitor that is formed on the first insulating layer by a planar electrode. Moreover, the planar electrode covers first zones in which portions of the coiled conductor patterns are adjacent to each other and current directions are opposite to each other in a plan view of the surface-mounted LC device.
Portable electronic device
An inductive coil capable of providing power to the battery is described. The inductive coil is formed of a length of a wire having a conductive core capable of carrying an electrical current. The conductive core is surrounded by an insulating layer that electrically isolates the conductive core. Portions of the length of wire include a magnetically permeable material that is plated on an exposed surface of the conductive core.
Systems and methods for reducing undesired eddy currents
Systems and methods to reduce the amplitude of undesirable eddy currents in conducting structures, e.g., induced by the translation of an FRC into a confinement chamber, while leaving beneficial eddy currents unaffected. This is achieved by inducing opposing currents in the same conducting structures prior to plasma translation into the confinement chamber.