Embodiment of the present invention includes a magnetic structure and a magnetic structure used in a direct current (DC) to DC energy converter. The magnetic structure has an E-core and a plate, with the plate positioned in contact or in near contact with the post surfaces of the E-core. The E-core has a base, a no-winding leg, a transformer leg, and an inductor leg. The no-winding leg, the transformer leg, and the inductor leg are perpendicular and magnetically in contact with the base. The plate is a flat slab with lateral dimensions generally larger than its thickness. The plate has a plate nose that overlaps a top no-winding leg surface of the no-winding leg with a no-winding gap area to form a no-winding gap with a no-winding gap reluctance. The plate also has a plate end that overlaps a top inductor leg surface of the inductor leg with an inductor gap area to form an inductor gap with an inductor gap reluctance. In some embodiments, e.g., where the duty cycle is less than 50 percent, the inductor gap reluctance will be designed to be less than the no-winding gap reluctance. In these cases, the majority of the magnetic flux that passes through the transformer leg will return through the inductor leg, instead of through the no-winding leg. The inductor and no-winding gap reluctances can he adjusted, so that the electromotive force applied to a charge passing through the inductor will partially cancel the electromotive force applied by the transformer secondary. The gap reluctance ratio can be defined, so that the difference in secondary and inductor electromotive forces is equal to the output voltage defined by an optimal no-ripple duty cycle. In this way no changing current is required through the inductor to create a dI/dt inductive voltage drop across the output inductor. Zero output current ripple is achieved.

Various embodiments of the plate, plate shape, and no-winding leg are disclosed. These embodiments allow achieving a high ratio of no-winding gap reluctance to inductor gap reluctance, for practical, affordable magnetic material structures and aspect ratios. A high gap reluctance ratio enables zero output current ripple for the high transformer turns ratios that are needed to achieve high input to output voltage ratios. The embodiments therefore allow achieving low output current ripple for 48 V or higher input voltages, 1 V or lower output voltages, and high output currents.

The present disclosure provides a semiconductor structure and a fabrication method thereof. The semiconductor structure includes: a base, wherein the base is provided with a first surface and a second surface that are opposite to each other; a magnetic core, wherein the magnetic core is located in the base, and an orthographic projection of the magnetic core on the first surface is a closed ring pattern; a dielectric layer, wherein the dielectric layer is located on the second surface; and a solenoid-shaped metal layer, wherein the metal layer is located in the base and the dielectric layer and is wound around the magnetic core; the metal layer is an integrated structure; the metal layer and the magnetic core are spaced apart from each other; part of the metal layer is exposed on the first surface.

A manufacturing method for a laminated iron core includes conveying a sheet steel strip in an intermittent manner in a lift up state, with upward movement of the strip being limited by a guiding member provided on a lower holder; punching an outer shape of each iron core laminae; and applying adhesive agent to a surface of the strip before the punching. The adhesive agent is applied in a state in which a pilot pin is inserted in a pilot hole of the strip and when the strip is about to be pressed against or is being pressed against the die plate by a stripper provided on an upper holder. After application of the adhesive agent, the strip is returned to the lift up state by raising the upper holder, with a lifter and the stripper plate being in abutment with the lower and upper surfaces of the strip, respectively.

Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.

Current transducer including a housing comprising a coil support, a magnetic core extending between a first end and a second end, and a coil comprising a plurality of windings formed around the coil support. The coil support comprises a core receiving channel within which the magnetic core is inserted, the coil support comprising a radially inner support portion and a radially outer support portion between which the core receiving channel is disposed. The radially inner support portion is slidably movable with respect to the radially outer support portion.

An inductive element includes a magnetic core, a flat coil wound on a middle column of the magnetic core, and a magnetic plastic package layer covering the magnetic core and the flat coil. Two electrodes connected to two pigtails of the flat coil are exposed outside of the magnetic plastic package layer. The flat coil is configured to enable a width direction of a flat wire of the flat coil to be perpendicular to an axial direction of the middle column of the magnetic core, and the flat wire is stacked layer by layer in the axial direction of the middle column. A manufacturing method for the inductive element is also disclosed herein. By using the wounding method of the flat coil of the inductive element, a height of a product may be reduced while obtaining a same DCR, so that the product is thinner.

A transformer core for a dry-type transformer includes a laminated construction having several groups of stacked laminations that form a step-lap sequence of laminations. Each group in the step-lap sequence has a mean length different than an adjacent group in the step-lap sequence and has at least two identical laminations per group, wherein at least one group has at least four identical laminations. Methods of assembling a transformer core are also provided, as are other aspects.

A test and measurement instrument, including at least one port configured to receive a signal from a device under test (DUT), the signal including a current signal acquired across a magnetic core of the DUT and a voltage signal acquired across the magnetic core of the DUT, and one or more processors. The one or more processors are configured to determine a hysteresis loop based on the current signal and the voltage signal, determine a magnetic flux of the magnetic core based on the voltage signal and the current signal for a number of sample points for each cycle, and determine a maximum magnetic flux for all cycles and a hysteresis loop cycle that corresponds to the maximum magnetic flux. A display configured to display at least one of the hysteresis loop, the signal received from the DUT, and the hysteresis loop cycle that corresponds to the maximum magnetic flux.

Systems and methods of the present disclosure enable adjustable multi-gapped combined common mode and differential mode three phase inductors using at least one core. The at least one core may include: a first core segments and at least one second core segment, where each first core segment has at least one first shape and where the first core segments are arranged in a first pattern so as to form differential mode gaps between each first core segment and the at least one second core segment. The first shape is such that the first pattern permits to independently adjust a thickness of each differential mode gap. The at least one second core segment has a second shape and the first core segments are in an interior of the core and the at least one second core segment at least partially encompasses the first core segments.

An example device includes a mounting surface including a first material having a first coefficient of thermal expansion (CTE). The device includes an intermediate plate coupled to the mounting surface and comprising a second material having a second CTE. The device includes a ferrite core coupled to the intermediate plate and comprising a third material having a third CTE, wherein the second CTE of the intermediate plate is between the first CTE of the mounting surface and the third CTE of the ferrite core.