Patent classifications
H01F41/0206
High voltage high frequency transformer
A transformer includes a closed loop core having a first leg and a second leg. The transformer also includes a first primary winding surrounding the first and second legs, a second primary winding surrounding the first and second legs, and first and second secondary windings surrounding the first and second legs, respectively, and disposed between the first and second primary windings. A first turn of the first and second secondary windings are disposed on a first interlayer winding layer, and other turns of the first and second secondary windings are disposed on a first layer that is further from the first primary winding than the first interlayer winding layer.
Transformer, electromagnetic device and manufacturing method of the transformer
A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.
Integrated magnetic core inductors on glass core substrates
A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.
APPARATUS FOR THE ASSEMBLY OF LAMELLAR PACKS FOR ELECTRICAL USE
An apparatus (10) for the assembly of lamellar packs for electrical use in electric motor machines, generators, transformers, counters, ignition coils and similar electrical equipment by gluing, comprising a die-cutting station (12) for die-cutting a sheet (15) to define strips (15′) to be superimposed one on the other to define a lamellar pack and a station (14) for gluing—by means of glue—said strips (15′) sheared from said sheet (15) and comprising means for the discrete application of an amount of glue on a surface of the sheet (15) and with said means operating synchronously with the advancement of the sheet (15) in the die-cutting station (12).
Thin film inductor and power conversion circuit
A thin film inductor is disclosed, which includes a thin film magnetic core. The thin film magnetic core includes at least one magnetic thin film. In each magnetic thin film, at least one type-1 gap is provided. A length direction of the type-1 gap is parallel to a direction of hard magnetization of the magnetic thin film. If the thin film magnetic core comprises at least two magnetic thin films, the at least two magnetic thin films are laminated and overlap each other. A sum of widths of all type-1 gaps in each magnetic thin film is the same.
Magnetic Core Assembly And Manufacturing Process Thereof
Optimum magnetic core assembly (100) and manufacturing process thereof comprising a primary magnetic alloy (101) and at least one supplementing magnetic alloy (102), made of a magnetic material (90) pre-coated with an electrically insulating layer (90C); the optimum open magnetic core assembly (100) has a pair of ends of a laminated magnetic core (110), each of the pair of ends of the optimum magnetic core assembly (100) being one of a co-facing (111) and a flat (113), or a co-facing (111) and a contoured (114), or a co-planer (112) and a flat (113), or a co-planer (112) and a contoured (114); a process of producing is one of a wrapping based process ONE (30) or a stamping based process TWO (40) followed by a magnetic performance treatment (50); the optimum magnetic core (100) is a hybrid core wherein the laminations are grouped and or interlaced laminations (70).
Reactor including outer iron-core and method for manufacturing the same
Provided is a reactor having a core main body that includes an outer peripheral iron core, at least three iron cores, and coils. Between the iron cores adjacent to each other, a gap being magnetically coupled is formed. The reactor includes a fixture that fixes both end portions of the at least three iron cores together by passing through an interior of the outer peripheral iron core in a region between the outer peripheral iron core and the gap. The fixture includes plate-like members disposed on both end faces of the core main body and includes rod-like members that connect the plate-like members to each other by passing through the interior of the outer peripheral iron core. The plate-like members each include a protrusion extending axially inward of the core main body.
APPARATUS AND METHOD FOR UNIFORM AIR GAP IN THIN FILM MAGNETIC CORES
A complex-shaped air gap for electrical components utilizing magnetically permeable material. The air is enabled to thermally distribute heat through a magnetic core and thus reduce issues relating to heat localization. The air gap shape is maximized for length, and in the preferred embodiment is a spiral shape. The preferred embodiment is built by a lithography process, without cutting, to enable the thin spiraling shape.
MAGNETIC STRUCTURES AND ARRANGEMENT OF INDUCTIVE PATHS
According to one configuration, a fabricator receives magnetic permeable material and fabricates an apparatus to include a multi-dimensional arrangement of electrically conductive paths to extend through the magnetic permeable material. Each of the electrically conductive paths is a respective inductive path.
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
An inductor structure, a package substrate, an integrated circuit device, an integrated circuit device assembly and a method of fabricating the inductor structure. The inductor structure includes: an electrically conductive body; and a magnetic structure including a non-electrically-conductive magnetic material, wherein: one of the magnetic structure or the electrically conductive body wraps around another one of the magnetic structure or the electrically conductive body to form the inductor structure therewith; and at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another.