Patent classifications
H01F41/04
Optical sensing methods and systems for transformers, and the construction thereof
Sensing methods and systems for transformers, and the construction thereof, are described herein. Example transformer systems and example methods for constructing a core for the system are disclosed. The example system includes a core with a bottom plate, two or more limbs mounted to the bottom plate and a top plate enclosing the core. At least one of the bottom plate, the limbs and the top plate is formed with a sensing component therein. The sensing component can be mounted to a spacer layer assembled within a stack of laminated layers. The sensing component can be mounted within a path defined within the spacer layer, for example. Methods for detecting operating conditions within the transformer are also disclosed.
Coil-embedded ceramic substrate
A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.
Magnetic wiring circuit board and producing method thereof
A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.
Systems and methods for thermal management in inductors
A thermal management includes an inductor, a housing in thermal communication with the inductor, the housing defining a wall, and a conductor. The conductor has a greater heat transfer rate than the wall and is positioned within a groove and/or an aperture formed in the wall. The conductor is configured to transfer heat through the wall more efficiently than if the conductor were not present. A method of manufacturing a thermal management system includes forming a housing by additive manufacturing. The housing defines a wall having at least one of a groove and an aperture defined therein. The method includes positioning a conductor in at least one of the groove and the aperture. The conductor has a greater heat transfer rate than the wall. The method includes positioning an inductor into thermal communication with the housing.
MULTILAYER INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER INDUCTOR COMPONENT
A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.
COIL MODULE AND METHOD FOR PRODUCING A COIL ASSEMBLY
A coil module comprises a carrier which has a polygonal basic shape with four to twelve corners and comprises a magnetic material. A coil is arranged on the carrier. The polygonal basic shape is rotationally symmetrical with an angle of 360°.Math.2 divided by the number of corners. To produce a coil assembly, a plurality of coil modules can be connected to each other. This makes it possible to produce an efficient coil assembly for wireless electromagnetic energy transmission in a simple and flexible manner.
COIL MODULE AND METHOD FOR PRODUCING A COIL ASSEMBLY
A coil module comprises a carrier which has a polygonal basic shape with four to twelve corners and comprises a magnetic material. A coil is arranged on the carrier. The polygonal basic shape is rotationally symmetrical with an angle of 360°.Math.2 divided by the number of corners. To produce a coil assembly, a plurality of coil modules can be connected to each other. This makes it possible to produce an efficient coil assembly for wireless electromagnetic energy transmission in a simple and flexible manner.
PLANAR COIL, AND DEVICE FOR MANUFACTURING SEMICONDUCTOR COMPRISING SAME
A planar coil (10) of the present disclosure includes a base (1) including a first surface (1a), a metal layer (2) located on the first surface (1a) and including a through hole (2a) and a plurality of voids (3), and a first fixing tool (8) inserted through the through hole (2a) and fixing the metal layer (2) to the first surface (1a) side of the base (1).
COIL AND METHOD FOR MANUFACTURING SAME
Provided are a coil capable of further improvement in heat dissipation performance and a method for manufacturing the same. A coil includes a helical structure formed of a hollow flat conductor.
COIL AND METHOD FOR MANUFACTURING SAME
Provided are a coil capable of further improvement in heat dissipation performance and a method for manufacturing the same. A coil includes a helical structure formed of a hollow flat conductor.