A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.

A magnetic sheet having improved acid/base-resistant properties, corrosion-resistance, and an excellent magnetic property at NFC, WPC, and MST frequencies, has little changes in weight and thickness even if the environment changes, for example, even after an etching treatment for patterning, or a reflow or soldering process which is performed for its application to a product.

A magnetic sheet having improved acid/base-resistant properties, corrosion-resistance, and an excellent magnetic property at NFC, WPC, and MST frequencies, has little changes in weight and thickness even if the environment changes, for example, even after an etching treatment for patterning, or a reflow or soldering process which is performed for its application to a product.

A magnetic ink reader includes a conveyance mechanism for a sheet, a magnetizing mechanism configured to magnetize magnetic ink on the sheet and including a magnet having a first side of a first magnetic polarity, that is arranged to face a first surface of the sheet, and a yoke that is formed of a soft magnetic material and includes a base portion attached directly to a second side of the magnet, and an extension portion extending from the base portion such that an end surface of the extension portion faces a second surface of the sheet, and a magnetic detection head along the conveyance path and configured to detect magnetism of the magnetized magnetic ink on the sheet. A first distance between the conveyance path and the first side of the magnet is less than a second distance between the conveyance path and the end surface of the yoke.

A multi-layered structure is provided, which includes a carrier and a resin coating on the carrier, wherein the resin coating is formed by magnetically aligning and drying a resin composition. The resin composition includes 1 part by weight of (a) crosslinkable monomer with a biphenyl group, 1.0 to 20.0 parts by weight of (b) polyphenylene oxide, 0.1 to 10.0 parts by weight of (c) hardener, and 0.1 to 80.0 parts by weight of (d) magnetic filler. (d) Magnetic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof, with a surface modified by iron-containing oxide. (d) Magnetic filler is sheet-shaped or needle-shaped.

A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.

A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.

Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.

A method of manufacturing a magnetically graded material, including depositing a steel filler material to a substrate, and applying a directed energy source to first and second regions of the filler material to thereby join the filler material to form a joined material. The energy source is directed to the first region while the first region is provided with an inert shield gas such that the material of the first regions includes a magnetic phase, and the energy source is directed to the second region while the second region is provided with a nitrogen containing shield gas to thereby impart an non-magnetic phase to the joined material.

A method of manufacturing a magnetically graded material, including depositing a steel filler material to a substrate, and applying a directed energy source to first and second regions of the filler material to thereby join the filler material to form a joined material. The energy source is directed to the first region while the first region is provided with an inert shield gas such that the material of the first regions includes a magnetic phase, and the energy source is directed to the second region while the second region is provided with a nitrogen containing shield gas to thereby impart an non-magnetic phase to the joined material.