The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.

The claimed invention provides a wet chemical method to prepare manganese bismuth nanoparticles having a particle diameter of 5 to 200 nm. When annealed at 550 to 600K in a field of 0 to 3 T the nanoparticles exhibit a coercivity of approximately 1 T and are suitable for utility as a permanent magnet material. A permanent magnet containing the annealed MnBi nanoparticles is also provided.

A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.

A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.

An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.

An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.

An electronic substrate may be fabricated by forming a base substrate and forming an inductor extending through the base substrate, wherein the inductor includes a magnetic material layer and a barrier layer, such that the barrier layer prevents the magnetic material layer from leaching into plating solutions during the fabrication of the electronic substrate. In one embodiment, the barrier material may comprise titanium. In another embodiment, the barrier layer may comprise a polymeric material. In still another embodiment, the barrier layer may comprise a nitride material layer. The inductor may further include a plating seed layer on the barrier layer and a conductive fill material abutting the plating seed layer.

The present invention provides a method for improving coercive force of magnets, this method comprises steps as follows: S2) coating step: coating a coating material on the surface of a magnet and drying it; and S3) infiltrating step: heat treating the magnet obtained from the coating step S2). The coating material comprises (1) metal calcium particles and (2) particles of a material containing a rare earth element; the rare earth element is at least one selected from Praseodymium, Neodymium, Gadolinium, Terbium, Dysprosium, Holmium, Erbium, Thulium, Ytterbium and Lutetium. The method of the present invention can significantly increase coercive force of a permanent magnet material, while remanence and magnetic energy product hardly decrease. In addition, the method of the present invention can significantly decrease the amount of a rare earth element, and accordingly, decrease the production cost.

The present invention provides a method for improving coercive force of magnets, this method comprises steps as follows: S2) coating step: coating a coating material on the surface of a magnet and drying it; and S3) infiltrating step: heat treating the magnet obtained from the coating step S2). The coating material comprises (1) metal calcium particles and (2) particles of a material containing a rare earth element; the rare earth element is at least one selected from Praseodymium, Neodymium, Gadolinium, Terbium, Dysprosium, Holmium, Erbium, Thulium, Ytterbium and Lutetium. The method of the present invention can significantly increase coercive force of a permanent magnet material, while remanence and magnetic energy product hardly decrease. In addition, the method of the present invention can significantly decrease the amount of a rare earth element, and accordingly, decrease the production cost.

A magnetic PCB generated by simultaneously spin-spraying a ferrite ion solution and an oxidant solution on a substrate plate while the substrate plate is rotated at a speed 40 rpm to about 300 rpm and heated at 40? C. to 300? C.