A capacitor assembly including at least one capacitor each having a first end and a second end spaced apart in a longitudinal direction, and a first terminal and a second terminal located at the first end of the capacitor, the first end being provided with a first surface, and the second end being provided with a second surface; a heat sink having a first cooling surface; and a connection system connecting the at least one capacitor heat conductively to the heat sink such that the second surface of each of the at least one capacitor is in heat conductive connection with the first cooling surface. The connection system is to in contact with the first surface of each of the at least one capacitor.

A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

A device for connecting a power source to an inductor, comprising at least three connection plates made of a conductive material and to which an arbitrary number of capacitors are electrically connected, the connection plates allowing an electrical connection between the power source and the inductor in a parallel, series or series-parallel configuration, characterized in that at least two connection plates are bent by substantially 90°, each forming two half-plates that are substantially perpendicular to one another, each half-plate being electrically connected to a different connection plate.

A wiring module is configured to attach to a power storage element group of an arranged plurality of power storage elements, each one of the power storage elements including an electrode terminal, including a bus bar that connects to the electrode terminal; a circuit board on which a conductive path is formed; and a relay member that connects the bus bar and the circuit board, wherein the relay member includes a bus bar connection portion that connects to the bus bar and a board connection portion that connects to the conductive path of the circuit board, the relay member includes a connection portion with a plate-like shape that joins the bus bar connection portion and the board connection portion and extends in a direction intersecting an arrangement direction of the plurality of power storage elements, and the connection portion includes a first deformation portion capable of deforming in the arrangement direction.

An electricity storage module according to the present invention is provided with: a plurality of arranged cylindrical electricity storage devices; and an upper holder which holds the upper end parts of the plurality of electricity storage devices, while being provided with a plurality of containing parts that is formed of a thermoplastic resin. The upper holder comprises an upper support member which is formed of a thermosetting resin and supports electricity storage devices adjacent to each other, while being positioned between the adjacent electricity storage devices. In comparison to the thermoplastic resin, the thermosetting resin is not susceptible to deformation or melting event if heat is applied thereto.

A semiconductor device, including a capacitor, a semiconductor module having a first power terminal formed on a front surface of a first insulating member, and a connecting member electrically connecting and mechanically coupling the semiconductor module and the capacitor to each other, the connecting member having a front surface and a rear surface opposite to each other, the rear surface being on a front surface of the first power terminal. The connecting member is bonded to the semiconductor module via a first welded portion, which penetrates the front and rear surfaces of the connecting member, and penetrates the front surface of the first power terminal, in a thickness direction of the semiconductor device, a distance in the thickness direction between a bottommost portion of first welded portion and the front surface of the first insulating member being 0.3 mm or more.

A semiconductor device, including a capacitor, a semiconductor module having a first power terminal formed on a front surface of a first insulating member, and a connecting member electrically connecting and mechanically coupling the semiconductor module and the capacitor to each other, the connecting member having a front surface and a rear surface opposite to each other, the rear surface being on a front surface of the first power terminal. The connecting member is bonded to the semiconductor module via a first welded portion, which penetrates the front and rear surfaces of the connecting member, and penetrates the front surface of the first power terminal, in a thickness direction of the semiconductor device, a distance in the thickness direction between a bottommost portion of first welded portion and the front surface of the first insulating member being 0.3 mm or more.

A DC link capacitor (8) comprises a capacitor housing, a plurality of capacitor cells (1), each comprising a film capacitor element (2) with a wound metallized film and two contact terminals (3a, 3b) connected to the metallized plastic film. The plurality of capacitor cells (1) are arranged in the capacitor housing (4) and are sealed therein by means of a sealing material (7). The contact terminals (3a, 3b) are electrically isolated from each other and protrude separately out of the sealing material (7), in order to be connected by means of bus bars.

A DC link capacitor (8) comprises a capacitor housing, a plurality of capacitor cells (1), each comprising a film capacitor element (2) with a wound metallized film and two contact terminals (3a, 3b) connected to the metallized plastic film. The plurality of capacitor cells (1) are arranged in the capacitor housing (4) and are sealed therein by means of a sealing material (7). The contact terminals (3a, 3b) are electrically isolated from each other and protrude separately out of the sealing material (7), in order to be connected by means of bus bars.

A wound capacitor is provided, the wound capacitor including a cooling channel for conducting coolant. The provided cooling channel includes an electrically non-conductive and thermally conductive material. A pulse-controlled inverter including the wound capacitor is provided. A motor vehicle including the pulse-controlled inverter and the wound capacitor are also provided.