H01G2/06

Low profile passive components and devices and packages including the same

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Ceramic electronic component, method of producing the same, and circuit board

A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.

Multilayer ceramic capacitor
11482380 · 2022-10-25 · ·

An interposer of a multilayer ceramic capacitor includes a first through-hole in which a first pass-through conductive portion is provided on an inside wall thereof. A first surface side of the first through-hole is filled with a first conductive joining material that recessed at a central portion thereof as the first through-hole is seen from a second surface toward a first surface. The interposer includes a second through-hole in which a second pass-through conductive portion is provided on an inside wall thereof. A first surface side of the second through-hole is filled with a second conductive joining material that is recessed at a central portion thereof as the second through-hole is seen from a second surface toward a first surface.

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

A multi-layer ceramic electronic component includes: a ceramic body having a substantially rectangular parallelepiped shape, the ceramic body including a first corner connecting a first main surface, a first side surface, and an end surface, a second corner connecting a second main surface, the first side surface, and the end surface, a third corner connecting the first main surface, a second side surface, and the end surface, a fourth corner connecting the second main surface, the second side surface, and the end surface, and a plurality of internal electrodes; and a pair of external electrodes each including a base layer and a first conductive resin layer including a first side surface resin portion disposed on the first side surface to cover the first corner and extending from the first corner to first and second axis directions, and covers at least a part of the base layer.

Electrochemical Energy Storage Device

An electrochemical energy storage device comprises: a cover plate (4), comprising a lead-out bar (41) and a fixing plate (42), wherein the lead-out bar (41) is a conductor, the fixing plate (42) is an insulator, and the lead-out bar (41) vertically passes through the fixing plate (42) and is fixed thereon; a housing (9), which is cylindrical and is provided with an opening at at least one end thereof, wherein the insulating fixing plate (42) and the opening of the housing (9) are connected in a sealed manner by means of a sealing ring (2); and a rolled core (7), provided in an inner cavity of the housing (9), wherein the rolled core (7) is conductively connected to the lead-out bar (41) by means of an upper connecting piece (6), and is conductively connected to another lead-out end of the housing (9) by means of a lower connecting piece (8); and the device further comprises: a welding ring (1), conductively connected to the housing (9) by means of welding, and a welding bar (3), conductively connected to the lead-out bar (41) of the cover plate (4) by means of welding, wherein the welding ring (1) and the welding bar (3) are provided on the same side of the housing (9). The upper connecting piece (6) and the lower connecting piece (8) respectively lead out the positive electrode and the negative electrode of the electrochemical energy storage device, and lead the positive electrode and the negative electrode to the outside. The device is led out at two ends, has a low internal resistance, and can be tin-soldered, thereby facilitating the assembly of modules.

Electronic component manufacturing method and apparatus

An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

Electronic component manufacturing method and apparatus

An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

CAPACITOR ELEMENT, ELECTROLYTIC CAPACITOR, INSULATING MATERIAL, AND METHOD FOR MANUFACTURING MOUNTING SUBSTRATE

A capacitor element includes an anode body, a dielectric layer disposed on a surface of the anode body, a solid electrolyte layer covering at least a part of the dielectric layer, and a cathode lead-out layer covering at least a part of the solid electrolyte layer. An insulating member is disposed from an outermost surface of the cathode lead-out layer to a depth of more than or equal to 0.001 μm.

MULTILAYER CAPACITOR

A multilayer capacitor includes a laminate having a first side surface and a second side surface, a first side covering portion covering the first side surface, and a second side covering portion covering the second side surface. The laminate includes first conductor layers, second conductor layers, dielectric layers and insulating layers laminated in the z direction. Each first conductor layer is connected to the first side covering portion and spaced apart from the second side covering portion. Each second conductor layer is connected to the second side covering portion and spaced apart from the first side covering portion. The insulating layers have a lower dielectric strength than the dielectric layers. Each dielectric layer is sandwiched between a first conductor layer and a second conductor layer. The insulating layers include one sandwiched between two first conductor layers and one sandwiched between two second conductor layers.

ELECTRONIC COMPONENT WITH METAL TERMINAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

An electronic component with a metal terminal includes an electronic component having an element body, and external electrodes respectively provided on end surfaces facing each other in an X direction in the element body; and plate-shaped metal terminals having joint portions joined to the external electrodes, and leg portions provided to protrude beyond the electronic component in a Z direction. The leg portion of the metal terminal has an extending part continuously extending in the Z direction from the joint portion, a first bent part bent from a tip of the extending part to the electronic component side at a first angle formed to be an acute angle with respect to the extending part, and a second bent part bent from a tip of the first bent part at a second angle larger than the first angle with respect to the extending part.