A filter module for a power conversion device, including: a capacitor module, an inductor module, and a case member, wherein the capacitor module includes: a positive-electrode side bus bar in which a positive-electrode terminal is formed, a negative-electrode side bus bar in which a negative-electrode terminal is formed, and a plurality of capacitor elements connected to the positive-electrode side bus bar and the negative-electrode side bus bar, respectively, wherein the inductor module includes: an inductor bus bar, and a magnetic member through which the inductor bus bar is inserted, and wherein the case member includes: a first space in which the capacitor module is accommodated, and a second space in which the inductor module is accommodated.

A capacitor module, in particular for use in an inverter of an electrical or a hybrid vehicle, said capacitor module comprising a housing, at least one capacitor element mounted in said housing and at least one busbar at least partially mounted into said housing and being electrically connected to said capacitor element, the housing comprising a bottom wall, a side wall and an upper wall, wherein said upper wall comprises a peripheral portion made of a sealing material and an central portion made of a thermal dissipation material, the thermal conductivity of the thermal dissipation material being bigger than the thermal conductivity of the sealing material.

A motor controller assembly is configured for use with an electric motor and includes a controller and an absorbent pad. The controller includes a capacitor with a capacitor shell and a liquid electrolyte contained therein. The capacitor shell has a frangible rupture area that opens during a capacitor rupture event to permit the discharge of liquid electrolyte from the capacitor shell. The absorbent pad overlies the rupture area to collect discharged liquid electrolyte.

A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.

A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.

A capacitance element that includes a first lower electrode and a second lower electrode arranged adjacent to each other in a Y-axis direction on a substrate. A first dielectric layer is on the first lower electrode, and a second dielectric layer is on the second lower electrode. A first upper electrode and a second upper electrode are arranged adjacent to each other in an X-axis direction on the first dielectric layer, and a third upper electrode and a fourth upper electrode are arranged adjacent to each other in an X-axis direction on the second dielectric layer. Interlayer conductors are respectively in contact with the first through fourth upper electrodes. A first connection conductor connects the second interlayer conductor and the fourth interlayer conductor to each other.

Package 1a has ceramic substrate body 2 having front and back surfaces 3, 4 and side surface 5 between these surfaces, cavity 6 opening on front surface 3 and having bottom surface 7 and inner side surface 8, electrode pad 9 formed on bottom surface 7, external connecting terminal 10 formed on back surface 4, electronic component 14 mounted on electrode pad 9 and electrolyte 16 filling cavity 6. Electrode pad 9 and external connecting terminal 10 are electrically connected to each other through via conductor 12 penetrating ceramic layer c1 forming bottom surface 7 of cavity 6 and back surface 4 of substrate body 2. Side surface conductor 17 is provided on side surface 5 of substrate body 2, and side surface conductor 17 and external connecting terminal 10 are connected to each other. Electrode pad 9 and side surface conductor 17 are separate from each other.

A capacitor includes a capacitor element, an electrode disposed on an end face of the capacitor element, a bus bar connected to the electrode, and a case housing the capacitor element. The bus bar is extended from an opening of the case to outside the case. Outside the case, the bus bar includes an extension part and a connection terminal. The extension part extends in a first direction along a side face of the case. The connection terminal is connected to the extension part. Further, the case includes a supporting part disposed on the side face of the case. The supporting part supports the bus bar to form a space between the side face and the extension part.

A ceramic electronic component of the present invention includes: a ceramic element body; a terminal electrode formed on from an end surface to a side surface of the ceramic element body; and a lead terminal joined to the terminal electrode by a solder. A fillet of the solder is formed between the terminal electrode of a side surface at the ceramic element body and the lead terminal, and a coating layer is formed on a surface of the lead terminal that is in contact with the solder. The coating layer is formed of a metal component having a contact angle with the solder smaller than that of the lead terminal.

A film capacitor includes a capacitor element, a first bus bar, and a second bus bar. The first bus bar includes a first electrode connecting part connected to the first electrode of the capacitor element at one end and a first connection terminal at another end. The second bus bar includes a second electrode connecting part connected to the second electrode of the capacitor element at one end and a second connection terminal at another end. The first bus bar includes a branch part that is branched from a position closer to the first electrode connecting part than the first connection terminal and extends toward the second electrode along a peripheral surface of the capacitor element. The second bus bar includes an overlapping part that overlaps at least a part of the branch part. The overlapping part is along the peripheral surface of the capacitor element.