A capacitor module, in particular for use in an inverter of an electrical or a hybrid vehicle, said capacitor module comprising a housing, at least one capacitor element mounted in said housing and at least one busbar at least partially mounted into said housing and being electrically connected to said capacitor element, the housing comprising a bottom wall, a side wall and an upper wall, wherein said upper wall comprises a peripheral portion made of a sealing material and an central portion made of a thermal dissipation material, the thermal conductivity of the thermal dissipation material being bigger than the thermal conductivity of the sealing material.

The present invention relates to an arrangement for fastening a capacitor cup within which a capacitor is accommodated. The arrangement is for fastening a capacitor cup onto an opening of a mid-plate, wherein the capacitor cup comprises a cylindrical body having an opening end and an opposite end. The arrangement comprises: a collar provided on an outer surface of the cylindrical body, closely around the opening end; at least one first engagement feature formed at the outer surface of the cylindrical body and adjacent to the collar; and, at least one second engagement feature, corresponding to the first engagement feature, formed at an edge of the opening of the mid-plate; wherein, an engagement between the first and second engagement features fastens the capacitor cup onto the opening of the mid-plate. This arrangement for fastening the capacitor cup according to the present invention eliminates additional fastening members or parts, and effectively creates and maintains an environmental seal between the electronics area and the environment.

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400 C. to about 700 C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400 C. to about 1,900 C. for up to 6 hours; and a cool down portion at a rate of up to 5/minute from a maximum sintering temperature down to about 1,000 C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

An electricity storage module includes: an electricity storage device; a case that houses the electricity storage device and includes a bottom surface part and the opening part located at a side opposite to the bottom surface part; a lid that covers an opening part; and a sealing member that seals between the case and the lid. The case has a first case surface that surrounds the opening part along an outer periphery of the opening part. The lid has a first lid surface facing the first case surface. The sealing member is disposed between the first case surface and the first lid surface.

A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.

A motor driving device includes a housing unit, a capacitor module, and a driving module. The housing unit includes a first compartment and a second compartment. The capacitor module is detachably mounted in the first compartment and includes a first circuit board, at least one capacitor electrically connected to the first circuit board, and two first conducting members electrically connected to the first circuit board. The driving module is mounted in the second compartment and includes a second circuit board and two second conducting members that are electrically connected to the second circuit board and that are respectively, electrically and detachably connected to the first conducting members.

In some examples, a feedthrough assembly for a medical device may include a ferrule. The ferrule defines an aperture extending through the ferrule from an outer end surface defined by the ferrule to an end inner end surface defined by the ferrule. The aperture includes a first portion having a first diameter and a second portion having a second diameter less than the first diameter. The aperture defines a longitudinal axis extending therethrough and the ferrule defines a ledge between the first and second portions of the aperture that extends radially inward toward the longitudinal axis. The feedthrough assembly further may include a conductive pin within the aperture and an insulating member surrounding at least a portion of the pin. The insulating member may electrically insulate the conductive pin from the ferrule, and the ledge and a surface of the insulating member adjacent the ledge may define a space therebetween.

An electronic device includes at least two chip components, a hold member with insulation, a first conductive terminal piece, a second conductive terminal piece, and an intermediate connection piece. The hold member holds the chip components side by side. The intermediate connection piece connects the terminal electrode of one of the chip components and the terminal electrode of the other chip component.

A vacuum-capacitor-type instrument voltage transformer (1) is equipped with a main capacitor (2) and an insulating tube (3) that accommodates the main capacitor (2). A voltage dividing capacitor (4) is connected to the main capacitor (2) in series. The main capacitor (2) is equipped with a plurality of vacuum capacitors (2a) to (2c) that are connected in series. A high-voltage-side electrode (6) is provided on a high-voltage side of the insulating tube (3), and a ground-side electrode (7) is provided on its low-voltage side. The high-voltage-side electrode (6) is equipped with a high-voltage shield (8). Electrostatic capacity of the vacuum capacitor (for example, the vacuum capacitor (2a)) disposed on the high-voltage side is set to be greater than electrostatic capacity of the vacuum capacitor (for example, the vacuum capacitor (2b)) disposed on the low-voltage side.

A method for producing a film capacitor, the method including a sealing material supplying step of supplying a curable sealing material 30a to an element accommodating space 20a in which a film capacitor element 10 having a rolled body 12 is accommodated; and a curing step of curing the sealing material 30a in a state in which the rolled body 12 is embedded in the sealing material 30a, in which at the time of initiating the sealing material supplying step, the rolled body 12 is not fixed by the sealing material 30a, and in the sealing material supplying step, the sealing material 30a is supplied to the element accommodating space 20a without curing the sealing material 30a, from the beginning of the supply of the sealing material 30a to the element accommodating space 20a until the rolled body 12 is embedded in the sealing material 30a.