In an embodiment, a multilayer ceramic capacitor 10 has supplementary dielectric layers 11d, each having a first cover part 11d1 that covers the space between two first base conductor films 11c on each of both height-direction faces, and second cover parts 11d2 that connect to the first cover part 11d1 and also cover parts of the first base conductor films 11c, respectively, in the length direction. External electrodes 12, 13 each have a second base conductor film 12a, 13a attached to a one length-direction face and to one length-direction edges of two first base conductor films 11c on the respective height-direction faces, and a surface conductor film 12b, 13b attached continuously to the surface of the second base conductor film 12a, 13a and also to the parts of the surfaces of the two first base conductor films 11c not covered by the second cover parts 11d2.

A rear bus bar includes a rear electrode connecting part connected to an upper end electrode of a capacitor element, and a rear overlapping part is led out upward from a rear electrode connecting part at a position overlapping with the upper end electrode. A front bus bar includes a front electrode connecting part connected to a lower end electrode of the capacitor element, a first relay part, and a second relay part extending along the upper end electrode, and a front overlapping part is led out upward from the second relay part. An insulation module includes a first insulating part interposed between the front overlapping part and the rear overlapping part, and a second insulating part interposed between the upper end electrode and the second relay part.

A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.

A film capacitor that includes a capacitor element having a metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein a surface free energy of an inner surface of the outer case in contact with the filling resin is 44 mN/m or less.

The capacitor includes a capacitor element, a busbar connected to an electrode of the capacitor element, a case housing the capacitor element, and a filling resin filled in the case. The case has a through-hole penetrating from an inner surface of the case to an outer surface of the case. The busbar includes a connection terminal part led out through the through-hole to the outside of the case. The capacitor further includes a sealing member that has a ring shape surrounding the connection terminal part and attaches to the connection terminal part. The sealing member abuts on a first region of the inner surface of the case to seal the through-hole, the first region surrounding the through-hole.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

The invention relates to a capacitive block, notably for an electrical equipment, comprising a case, a capacitive element housed in the case, a substance filling the space between the case and the capacitive element so as to ensure leak tightness of the capacitive element, a heat sink against which the capacitive element is in direct contact. In the capacitive block, the heat sink is different from the filling substance, a face of said heat sink, designated free face, forming an outer face of the capacitive block and being devoid of said filling substance.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400 C. to about 700 C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400 C. to about 1,900 C. for up to 6 hours; and a cool down portion at a rate of up to 5/minute from a maximum sintering temperature down to about 1,000 C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.