Patent classifications
H01G2/103
Ceramic electronic component and manufacturing method therefor
A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.
COLOR-CHANGEABLE CAPACITOR PACKAGE STRUCTURE AND COLOR-CHANGEABLE CAPACITOR CASING STRUCTURE THEREOF, AND CIRCUIT BOARD ASSEMBLY
The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a color display layer for showing a color that is changeable by receiving a light source.
ELECTRONIC COMPONENT
An electronic component is provided with a housing, a conductive terminal loaded on the housing, and an external conductive member loaded on the housing. A gap between the external conductive member and the conductive terminal is defined by a protrusion formed on the housing or the external conductive member.
CAPACITOR MODULE
Provided is a capacitor module for smoothing voltage including: a substantially rectangular capacitor case; a pair of bus bars forming a plurality of positive electrodes and negative electrodes provided so as to project out towards surrounding of the capacitor case; and a pair of high-voltage wires forming a positive electrode and a negative electrode having flexibility, the pair of high-voltage wires being configured to be drawn from the capacitor case, wherein the bus bars are connected to a power module and a DC/DC converter, the power module being configured to convert direct-current electric power from a driving power supply and alternating-current electric power to be supplied to a load, and the DC/DC converter being configured to convert voltage of the direct-current electric power, and the high-voltage wires are connected to a charger configured to convert external electrical power to direct-current electric power and charge the driving power supply therewith, the external electrical power being supplied via an external connector, and the external electrical power being of lower voltage relative to the driving power supply.
Multilayer ceramic electronic component
A multilayer ceramic electronic component includes: a capacitor set including a plurality of multilayer ceramic capacitors connected in series and accommodated in an insulation case while exposing external electrodes provided on both end portions thereof; and a pair of metal terminals connected to the external electrodes exposed outside of the insulation case, respectively. One end portion of the capacitor set is elastically supported by one of the pair of metal terminals.
High pressure resistant capacitor assembly and assembly method
A capacitor assembly includes at least two capacitor stacks, which have a layer structure including a top layer and a bottom layer. A support assembly supports the capacitor stacks. The capacitor stacks are stacked on top of each other in the support assembly. The support assembly has a compression member which compresses the at least two capacitor stacks in a direction substantially perpendicular to the layer structure. A pressure distribution arrangement adjusts the distribution of the pressure applied to the capacitor stacks by the compression member.
Electronic device, and electronic structure provided with electronic device
An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.
BIAXIALLY ORIENTED POLYPROPYLENE FILM FOR CAPACITOR, METAL LAMINATED FILM, AND FILM CAPACITOR
A biaxially oriented polypropylene film for a capacitor, in which dm and dt are each 0.60-1.70 and the value of the ratio (dm/dt) of dm and dt is 0.75 to less than 1.15, where dm is the kinetic friction coefficient in a longitudinal direction and dt is the kinetic friction coefficient in a width direction has the film thickness measured by a micrometer method of 0.5-3 m. The biaxially oriented polypropylene film for a capacitor has excellent voltage withstanding ability and is demonstrated in a capacitor application, and stable productivity and workability are ensured.
Capacitor with pressure interrupter
A capacitor is provided with a case having a receptacle with an expandable section that allows the receptacle to extend axially when internal pressure builds within the case as a result of a fault. Terminals are mounted on the cover and electrically connected to the electrodes of a capacitor element through an interrupter plate, via leads. The plate is attached to the section of the case that extends under pressure, whereby the plate is drawn away from the cover, thereby breaking the electrical connections to the terminal. The plate may also work in conjunction with a cover that expands outward in response to internal pressure, to provide a second pressure interrupter mechanism.
COLOR-CHANGEABLE CAPACITOR PACKAGE STRUCTURE AND COLOR-CHANGEABLE CAPACITOR CASING STRUCTURE THEREOF, AND CIRCUIT BOARD ASSEMBLY
The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a thermochromic layer for showing a color that is changeable according to temperature variation.