Patent classifications
H01G2/103
Case-mold-type capacitor and method for producing same
A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.
Capacitor carrier assembly with housing having encapsulation features
A capacitor carrier assembly includes a carrier, a capacitor disposed in the carrier and electrically conductive connection terminals that support the carrier with respect to another electronic component or device such as a printed circuit board. Each connection terminal has a body portion that is electrically connected to one capacitor lead of the pair of capacitor leads at a connection location, and a device connection portion that protrudes from the carrier. Leads of the capacitor and the connection locations are encapsulated by wall structures of the carrier.
Anode for use in a high voltage electrolytic capacitor
An anode for use in a high voltage electrolytic capacitor is provided. The anode contains a sintered porous pellet and a leadwire extending therefrom in a longitudinal direction. The pellet is multi-layered to the extent that it contains at least a first layer positioned adjacent to a second layer, both of which extend along the length of the anode. The anode leadwire is embedded within the first layer. For this reason, the first layer has a thickness greater than that of the leadwire. Nevertheless, the use of a separate and distinct second layer adjacent to the first layer can allow each of the layers to be independently pressed using a multi-sided compaction device so that the properties of the anode are not significantly impacted by the presence of the relatively large anode leadwire.
ELECTRONIC DEVICE, AND ELECTRONIC STRUCTURE PROVIDED WITH ELECTRONIC DEVICE
An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.
Medical device feedthrough assemblies with strain relief
Feedthrough assemblies for medical devices having various embodiments of strain relief members extending around portions of the feed through pin are described.
Filter module for power conversion device
A filter module for a power conversion device, including: a capacitor module, an inductor module, and a case member, wherein the capacitor module includes: a positive-electrode side bus bar in which a positive-electrode terminal is formed, a negative-electrode side bus bar in which a negative-electrode terminal is formed, and a plurality of capacitor elements connected to the positive-electrode side bus bar and the negative-electrode side bus bar, respectively, wherein the inductor module includes: an inductor bus bar, and a magnetic member through which the inductor bus bar is inserted, and wherein the case member includes: a first space in which the capacitor module is accommodated, and a second space in which the inductor module is accommodated.
FEED-THROUGH
A feed-through through a housing part of a housing, for example of a battery or a capacitor made of a metal, wherein the housing part has at least one opening, through which at least one conductor is fed in a glass or glass ceramic material, and wherein the conductor has at least two sections in the axial direction, a first section made of a first material, e.g. aluminium, and a second section made of a second material, e.g. copper, as well as a transition from the first to the second material, and wherein the transition from the first to the second material is located in the region of the glass or glass ceramic material, said glass or glass ceramic material being adapted to the metal of the housing in such a way that a compression glass-to-metal seal is formed.
CAPACITOR CONNECTION STRUCTURE OF POWER CONVERSION DEVICE AND METHOD FOR CONNECTING CAPACITOR GROUP
A capacitor connection structure of a power conversion device, includes a capacitor having a capacitor end face from which a positive electrode terminal and a negative electrode terminal protrudes that is deformed outward into a convex shape when the fuse is blown, a positive electrode-side main conductor and a negative electrode-side main conductor that are formed by a thick plate and that are connected to another electronic component at positions facing the capacitor end face; a positive electrode-side intermediate conductor that connects the positive electrode terminal to the positive electrode-side main conductor; and a negative electrode-side intermediate conductor that connects the negative electrode terminal to the negative electrode-side main conductor. When the capacitor end face is deformed into the convex shape, the positive electrode-side intermediate conductor and the negative electrode-side intermediate conductor are deformed along with inclination of the positive electrode terminal and the negative electrode terminal.
ELECTRICITY STORAGE MODULE
An electricity storage module includes: an electricity storage element group formed by aligning multiple electricity storage elements; detection wires that have end portions on one side connected to the electricity storage elements and detect the states of the electricity storage elements; a detection wire connector that is connected to other end portions on a side opposite to that of the end portions on the one side of the detection wires that are connected to the electricity storage elements; a device connector that electrically connects the detection wires and an external device by fitting into the detection wire connector; and a cover that covers a surface on a side on which the detection wires of the electricity storage element group are disposed. The cover is provided with a fixing hole that fixes the detection wire connector and the device connector in a state of being fit together.
Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board
A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.