A capacitor component comprising a first busbar, a second busbar, one or more capacitor elements and a housing, the housing having a first portion and a second portion, wherein the first portion and the second portion are arranged to extend around an aperture, the first portion includes a section for housing the one or more capacitor elements, with the second portion extending between a first end and a second end of the first portion, wherein the first busbar and the second busbar are arranged to extend around the first portion and the second portion of the housing, a first power supply terminal is formed at the first end of the first portion and a second power supply terminal is formed at the second end of the first portion, wherein the first power supply terminal is coupled to the first busbar and the second power supply terminal is coupled to the second busbar, wherein a first conductive layer of the one or more capacitor elements is coupled to the first busbar and a second conductive layer of the one or more capacitor elements is coupled to the second busbar.

The present invention relates to a half bridge induction heating generator, comprising at least one power terminal (10) provided for a direct current voltage, at least one ground terminal (12), and four capacitors (C2, C3, C4, C5) forming a bridge circuit between the power terminal (10) and the ground terminal (12). The induction heating generator comprises further an induction coil (L) interconnected in the center of said bridge circuit, two semiconductor switches (Q1, Q2) connected in each case parallel to one of the both capacitors (C4, C5) on one side of the bridge circuit, and a further capacitor (CI) interconnected between the power terminal (10) and the ground terminal (12). The four capacitors (C2, C3, C4, C5) of the bridge circuit and the further capacitor (C1) are arranged inside a common housing (20), wherein said housing (20) and the capacitors (C1, C2, C3, C4, C5) form a capacitor assembly, which is a single component and mounted or mountable on and electrically connected or connectable to a printed circuit board. Further, the present invention relates to a capacitor assembly provided for said half bridge induction heating generator.

Feedthrough assemblies for medical devices having various embodiments of strain relief members extending around portions of the feed through pin are described.

A filter module for a power conversion device, including: a capacitor module, an inductor module, and a case member, wherein the capacitor module includes: a positive-electrode side bus bar in which a positive-electrode terminal is formed, a negative-electrode side bus bar in which a negative-electrode terminal is formed, and a plurality of capacitor elements connected to the positive-electrode side bus bar and the negative-electrode side bus bar, respectively, wherein the inductor module includes: an inductor bus bar, and a magnetic member through which the inductor bus bar is inserted, and wherein the case member includes: a first space in which the capacitor module is accommodated, and a second space in which the inductor module is accommodated.

An electronic device is provided. The electronic device includes a housing, an antenna radiating body including a conductive metal, a first member disposed within the housing and electrically connected to the antenna radiating body, a printed circuit board (PCB) disposed within the housing, a flexible connecting member disposed between at least a portion of the first member and at least a portion of a second member and including a conductive material, and a capacitor including a first conductive plate that contacts the second member or formed by a portion of the second member, a second conductive plate, separated from the first conductive plate and electrically connected to the PCB, and a dielectric layer inserted between the first conductive plate and the second conductive plate.

A method of mounting a capacitor to a bracket is provided. The method includes the step of providing a capacitor with an outer shell, a capacitor member disposed within the shell and a conductor member disposed within the outer shell and thermally coupled to the capacitor member. A collet is arranged having a first opening sized to slidingly engage the conductor member. A sleeve is provided having a second opening sized to receive a first end of the collet. The collet is slid onto the conductor member. The collet is pressed into the sleeve.

A semiconductor device, including a capacitor, a semiconductor module having a first power terminal formed on a front surface of a first insulating member, and a connecting member electrically connecting and mechanically coupling the semiconductor module and the capacitor to each other, the connecting member having a front surface and a rear surface opposite to each other, the rear surface being on a front surface of the first power terminal. The connecting member is bonded to the semiconductor module via a first welded portion, which penetrates the front and rear surfaces of the connecting member, and penetrates the front surface of the first power terminal, in a thickness direction of the semiconductor device, a distance in the thickness direction between a bottommost portion of first welded portion and the front surface of the first insulating member being 0.3 mm or more.

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.

A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.

The object of the invention is an electrical assembly, in particular a capacitive block, comprising a capacitive element, at least one electric connector secured to said capacitive element and a casing having a bottom, a side wall and an aperture through which the capacitive element is inserted, said casing comprising at least one shoulder on the side of the aperture, said shoulder forming a stop configured to receive in abutment said at least one electric connector, so as to support said capacitive element.