H01G2/16

Diagnostic device, energy storage apparatus, and diagnostic method
11927636 · 2024-03-12 · ·

A diagnostic device and method diagnoses damage to a breaker that interrupts a current of an energy storage device. The damage to the breaker is diagnosed on the basis of a short-circuit current at a time of an external short circuit. The damage to the breaker can also be diagnosed on a basis of a short-circuit current during a first time from detection to interruption of a short circuit, and a short-circuit current during a second time from the interruption to convergence of the short-circuit current. An energy storage apparatus can include the diagnostic device.

Diagnostic device, energy storage apparatus, and diagnostic method
11927636 · 2024-03-12 · ·

A diagnostic device and method diagnoses damage to a breaker that interrupts a current of an energy storage device. The damage to the breaker is diagnosed on the basis of a short-circuit current at a time of an external short circuit. The damage to the breaker can also be diagnosed on a basis of a short-circuit current during a first time from detection to interruption of a short circuit, and a short-circuit current during a second time from the interruption to convergence of the short-circuit current. An energy storage apparatus can include the diagnostic device.

CAPACITOR DEVICE
20190362900 · 2019-11-28 · ·

A capacitor circuit (capacitor device 20, 30, 34, 50) in which a plurality of capacitors (41 to 45) are connected to each other is included, one or two or more capacitors (overvoltage short-circuiting capacitors 40, 40a, 40b, 40c, 40d) in the capacitor circuit have a dielectric breakdown voltage made lower than that of another capacitor, and the one or two or more capacitors having the lower dielectric breakdown voltage are subjected to dielectric breakdown due to application of an overvoltage earlier than the other capacitor so that the capacitor circuit is short-circuited. As a result, the safety of the capacitor device and a device connected thereto can be enhanced.

Power storage device, power supply device, moving body, capacitor, and method for protecting power storage device

A power storage device includes a plurality of power storage units and a plurality of disconnection units. The plurality of power storage units are electrically connected in parallel between a pair of connection points. The plurality of disconnection units each connect to a corresponding power storage unit in the plurality of power storage units. Each of the plurality of disconnection units is configured to electrically disconnect between the corresponding power storage unit and at least one of the pair of connection points in accordance with flowing of a current at a value more than or equal to a predetermined value in the corresponding power storage unit.

ADAPTOR FOR A CAPACITOR
20190318873 · 2019-10-17 ·

A system includes a capacitor including: a structure, and one or more capacitive devices at the structure; and an electrically insulating bushing including: a fuse including: a fuse body including a fuse housing, a first fuse end, and a second fuse end, the fuse housing extending from the first fuse end to the second fuse end and defining an interior space, and a fusible element in the interior space, the fusible element electrically connected to the first fuse end and the second fuse end; and an adaptor including: an adaptor body extending from a first adaptor end to a second adaptor end, the adaptor body hermetically sealed to the structure and the second adaptor end configured to receive the first fuse end, and an adaptor connection interface in the adaptor body. The first fuse end is removably connected to the adaptor at the adaptor connection interface.

METHOD OF MANUFACTURING A CHIP COMPONENT

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

METHOD OF MANUFACTURING A CHIP COMPONENT

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

Power capacitor unit for high pressure applications

A power capacitor unit for high-pressure applications is provided. The power capacitor unit includes a housing, a plurality of capacitor elements connected to each other and arranged inside the housing, a dielectric liquid (L), a solid electrical insulation system arranged to electrically insulate each capacitor element, a busbar, a plurality of fuse wires, each fuse wire having a first end connected to a respective capacitor element and a second end connected to the busbar (B), wherein the capacitor elements, the solid electrical insulation system, and the fuse wires are immersed in the dielectric liquid (L). Each fuse wire has a plurality of first sections that are in physical contact with the electrical insulation system, and wherein each fuse wire has a plurality of second sections without physical contact with the solid electrical insulation system.

Power capacitor unit for high pressure applications

A power capacitor unit for high-pressure applications is provided. The power capacitor unit includes a housing, a plurality of capacitor elements connected to each other and arranged inside the housing, a dielectric liquid (L), a solid electrical insulation system arranged to electrically insulate each capacitor element, a busbar, a plurality of fuse wires, each fuse wire having a first end connected to a respective capacitor element and a second end connected to the busbar (B), wherein the capacitor elements, the solid electrical insulation system, and the fuse wires are immersed in the dielectric liquid (L). Each fuse wire has a plurality of first sections that are in physical contact with the electrical insulation system, and wherein each fuse wire has a plurality of second sections without physical contact with the solid electrical insulation system.

Electronic component fuse and fused electronic component module

In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.