Patent classifications
H01G5/011
Method of manufacturing a MEMS DVC device
The present invention generally relates to a MEMS DVC having a shielding electrode structure between the RF electrode and one or more other electrodes that cause a plate to move. The shielding electrode structure may be grounded and, in essence, block or shield the RF electrode from the one or more electrodes that cause the plate to move. By shielding the RF electrode, coupling of the RF electrode to the one or more electrodes that cause the plate to move is reduced and capacitance modulation is reduced or even eliminated.
Method of manufacturing a MEMS DVC device
The present invention generally relates to a MEMS DVC having a shielding electrode structure between the RF electrode and one or more other electrodes that cause a plate to move. The shielding electrode structure may be grounded and, in essence, block or shield the RF electrode from the one or more electrodes that cause the plate to move. By shielding the RF electrode, coupling of the RF electrode to the one or more electrodes that cause the plate to move is reduced and capacitance modulation is reduced or even eliminated.
Electrode unit for a vacuum capacitor and a vacuum capacitor
The present invention relates to an electrode unit (10, 20) for an electric vacuum capacitor comprising a band-shaped capacitor plate (11, 21) with a height H, wherein the band-shaped capacitor plate (11, 21) is wound in a spiral with a maximum diameter D.sub.max and a constant distance between successive turns, wherein the band-shaped capacitor plate (11, 21) comprises a first longitudinal edge (11a, 21a) attached to a supporting part (12) and a second longitudinal edge (11b, 21b), the second longitudinal edge (11b, 21b) being free, wherein at the outer extremity of the spiral, the first longitudinal edge (11a, 21a) and the second longitudinal edge (11b, 21b) are connected by an inclined edge (11c, 21c) such that the first longitudinal edge (11a, 21a) is longer than the second longitudinal edge (11b, 21b), wherein the inclined edge (11c, 21c) forms with the longitudinal axis (B) of the band-shaped capacitor plate (11, 21) an angle ? less than or equal to an angle ?.sub.max=(45?.Math.?/180?). The invention relates also to a vacuum capacitor (30) comprising at least one electrode unit (10, 20) according to the present invention.
Electrode unit for a vacuum capacitor and a vacuum capacitor
The present invention relates to an electrode unit (10, 20) for an electric vacuum capacitor comprising a band-shaped capacitor plate (11, 21) with a height H, wherein the band-shaped capacitor plate (11, 21) is wound in a spiral with a maximum diameter D.sub.max and a constant distance between successive turns, wherein the band-shaped capacitor plate (11, 21) comprises a first longitudinal edge (11a, 21a) attached to a supporting part (12) and a second longitudinal edge (11b, 21b), the second longitudinal edge (11b, 21b) being free, wherein at the outer extremity of the spiral, the first longitudinal edge (11a, 21a) and the second longitudinal edge (11b, 21b) are connected by an inclined edge (11c, 21c) such that the first longitudinal edge (11a, 21a) is longer than the second longitudinal edge (11b, 21b), wherein the inclined edge (11c, 21c) forms with the longitudinal axis (B) of the band-shaped capacitor plate (11, 21) an angle ? less than or equal to an angle ?.sub.max=(45?.Math.?/180?). The invention relates also to a vacuum capacitor (30) comprising at least one electrode unit (10, 20) according to the present invention.
CHIP CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.
CHIP CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.
Antenna having MEMS-tuned RF resonators
An antenna having radio-frequency (RF) resonators and methods for fabricating the same are described. In one embodiment, the antenna comprises a physical antenna aperture having an array of antenna elements, where the array of antenna elements includes a plurality of radio-frequency (RF) resonators, with each RF resonator of the plurality of RF resonators having an RF radiating element with a microelectromchanical systems (MEMS) device.
Antenna having MEMS-tuned RF resonators
An antenna having radio-frequency (RF) resonators and methods for fabricating the same are described. In one embodiment, the antenna comprises a physical antenna aperture having an array of antenna elements, where the array of antenna elements includes a plurality of radio-frequency (RF) resonators, with each RF resonator of the plurality of RF resonators having an RF radiating element with a microelectromchanical systems (MEMS) device.
DEFORMABLE ELECTRODES AND DEVICES FOR CONVERTING MECHANICAL ENERGY TO ELECTRICAL ENERGY
Deformable electrodes, deformable supercapacitors comprising the deformable electrodes, and electric circuits comprising the supercapacitors are provided. Methods of using the supercapacitors to convert mechanical energy to electrical energy are also provided. The supercapacitors include a liquid electrolyte disposed between two electrodes, at least one of which is reversibly deformable when it is compressed. The liquid electrolyte is infused into the deformable electrode and the supercapacitors are characterized in that the deformation of the deformable electrodes causes the interfacial area between the electrolyte and the deformable electrode to decrease when the electrode is deformed.
PRESSURE DETECTION SENSOR
A pressure detection sensor according to one embodiment of the present invention includes a first electrode layer including a channel portion configured to output a sensing signal and a wiring portion connected to the channel portion, a first elastic dielectric layer disposed on the first electrode layer, a second electrode layer disposed on the first elastic dielectric layer at a position corresponding to the channel portion, a second elastic dielectric layer disposed on the second electrode layer, and a third electrode layer disposed on the second elastic dielectric layer, wherein, when a pressure is applied to the third electrode layer, capacitances of the first elastic dielectric layer and the second elastic dielectric layer are changed.