A pressure detection sensor according to one embodiment of the present invention includes a first electrode layer including a channel portion configured to output a sensing signal and a wiring portion connected to the channel portion, a first elastic dielectric layer disposed on the first electrode layer, a second electrode layer disposed on the first elastic dielectric layer at a position corresponding to the channel portion, a second elastic dielectric layer disposed on the second electrode layer, and a third electrode layer disposed on the second elastic dielectric layer, wherein, when a pressure is applied to the third electrode layer, capacitances of the first elastic dielectric layer and the second elastic dielectric layer are changed.

A capacitive vapor sensor, sensor system, and method for determining a vapor concentration is provided. The capacitive sensor includes a first electrode and a second electrode. The first and second electrodes are configured to provide a bias voltage. The sensor further includes a cantilevered sensor electrode interdigitated between the first and second electrodes and having an adsorptive polymer attached to a surface of the cantilevered sensor electrode. The adsorptive polymer is configured to expand in response to adsorbing a vapor and cause a deflection of the cantilevered sensor electrode, the deflection causing a change in a differential capacitance of the first and second electrodes. A sensor indicates current at the cantilevered sensor electrode, and an electronic processor determines the change in the differential capacitance to determine a characteristic or concentration of the vapor.

A capacitive vapor sensor, sensor system, and method for determining a vapor concentration is provided. The capacitive sensor includes a first electrode and a second electrode. The first and second electrodes are configured to provide a bias voltage. The sensor further includes a cantilevered sensor electrode interdigitated between the first and second electrodes and having an adsorptive polymer attached to a surface of the cantilevered sensor electrode. The adsorptive polymer is configured to expand in response to adsorbing a vapor and cause a deflection of the cantilevered sensor electrode, the deflection causing a change in a differential capacitance of the first and second electrodes. A sensor indicates current at the cantilevered sensor electrode, and an electronic processor determines the change in the differential capacitance to determine a characteristic or concentration of the vapor.

Provided are: a flexible electrode in which an increase in resistance change rate caused by repeated stretch is reduced; a sensor element comprising the flexible electrode; and a strain sensor, a pressure sensor, and a temperature sensor each comprising the sensor element, wherein the flexible electrode comprises: an insulating flexible substrate; and an electrode film comprising a fibrous carbon nanohorn aggregate and being laminated on the flexible substrate.

Provided are: a flexible electrode in which an increase in resistance change rate caused by repeated stretch is reduced; a sensor element comprising the flexible electrode; and a strain sensor, a pressure sensor, and a temperature sensor each comprising the sensor element, wherein the flexible electrode comprises: an insulating flexible substrate; and an electrode film comprising a fibrous carbon nanohorn aggregate and being laminated on the flexible substrate.

Provided is a long-life electret device preventing charge degradation of an electret element sealed in a closed space. The provided electret device includes a package member; a lid member; and an electret element. The lid member seals the package member to thereby form a closed space, the electret element is placed in the closed space, and a hydrogen getter is included in at least part of an inside of the closed space.

A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.

A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.