[Theme] To provide a chip capacitor capable of easily and rapidly accommodating a plurality of types of capacitance values using a common design and a method for manufacturing the chip capacitor. [Solution] A chip capacitor 1 includes a substrate 2, a first external electrode 3, a second external electrode 4, capacitor elements C1 to C19, and fuses F1 to F9 disposed on the substrate 2. The capacitor elements C1 to C19 respectively include a first electrode film 11, a first capacitance film 12 on the first electrode film 11, a second electrode film 13 disposed on the first capacitance film 12 and facing the first electrode film 11, a second capacitance film 17 on the second electrode film 13, and a third electrode film 16 disposed on the second capacitance film 17 and facing the second electrode film 13 and are connected between the first external electrode 3 and the second external electrode 4. The fuses F1 to F9 are each interposed between the capacitor elements C1 to C19 and the first external electrode 3 or the second external electrode 4 and are capable of disconnecting each of the capacitor elements C1 to C19.

A vacuum variable capacitor includes a pre-vacuum enclosure for reducing a pressure differential across the bellows. The vacuum force load on the drive system can thereby be reduced, allowing faster movement of the movable electrode, faster capacitance adjustment of the vacuum variable capacitor and longer lifetimes of the device.

A vacuum variable capacitor includes a pre-vacuum enclosure for reducing a pressure differential across the bellows. The vacuum force load on the drive system can thereby be reduced, allowing faster movement of the movable electrode, faster capacitance adjustment of the vacuum variable capacitor and longer lifetimes of the device.

An antenna having radio-frequency (RF) resonators with tunable capacitors. In one embodiment, the tunable capacitor for tuning an RF resonator comprises: a first substrate with a first electrode attached thereto; a second substrate with a second electrode attached thereto; and a membrane between the first and second electrodes, the membrane being movable between the first and second electrodes in order to change capacitance.

An antenna having radio-frequency (RF) resonators with tunable capacitors. In one embodiment, the tunable capacitor for tuning an RF resonator comprises: a first substrate with a first electrode attached thereto; a second substrate with a second electrode attached thereto; and a membrane between the first and second electrodes, the membrane being movable between the first and second electrodes in order to change capacitance.

The present invention generally relates to a MEMS DVC having a shielding electrode structure between the RF electrode and one or more other electrodes that cause a plate to move. The shielding electrode structure may be grounded and, in essence, block or shield the RF electrode from the one or more electrodes that cause the plate to move. By shielding the RF electrode, coupling of the RF electrode to the one or more electrodes that cause the plate to move is reduced and capacitance modulation is reduced or even eliminated.

The present invention generally relates to a MEMS DVC having a shielding electrode structure between the RF electrode and one or more other electrodes that cause a plate to move. The shielding electrode structure may be grounded and, in essence, block or shield the RF electrode from the one or more electrodes that cause the plate to move. By shielding the RF electrode, coupling of the RF electrode to the one or more electrodes that cause the plate to move is reduced and capacitance modulation is reduced or even eliminated.

A variable capacitor includes a fixed main capacitor electrode disposed in a first metal layer overlying a substrate, a second main capacitor electrode spaced from the fixed main capacitor electrode, and a movable capacitor electrode disposed in the first metal layer adjacent the fixed main capacitor electrode. The movable capacitor electrode can be caused to be in a first position ohmically electrically connected to the fixed main capacitor electrode such that the variable capacitor has a first capacitance value or in a second position spaced from the fixed main capacitor electrode such that the variable capacitor has a second capacitance value.

A variable capacitor includes a fixed main capacitor electrode disposed in a first metal layer overlying a substrate, a second main capacitor electrode spaced from the fixed main capacitor electrode, and a movable capacitor electrode disposed in the first metal layer adjacent the fixed main capacitor electrode. The movable capacitor electrode can be caused to be in a first position ohmically electrically connected to the fixed main capacitor electrode such that the variable capacitor has a first capacitance value or in a second position spaced from the fixed main capacitor electrode such that the variable capacitor has a second capacitance value.

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.