H01G5/14

PLASMA PROCESSING APPARATUS
20200219701 · 2020-07-09 · ·

An apparatus for plasma processing includes a chamber, a substrate support having a lower electrode and an electrostatic chuck disposed on the lower electrode and configured to support a substrate mounted on the electrostatic chuck in the chamber, and a radio frequency power supply configured to supply a radio frequency power to generate plasma in the chamber. Further, in the apparatus, a bias power supply supplies a bias power. A first electrical path electrically connects the bias power supply and the lower electrode, and a second electrical path that is different from the first electrical path and the lower electrode is configured to supply the bias power from the lower electrode or the first electrical path to an edge ring disposed to surround an edge of the substrate. Further, an impedance adjuster provides a variable impedance to the second electrical path.

MICROELECTRONIC DEVICES DESIGNED WITH PACKAGE INTEGRATED VARIABLE CAPACITORS HAVING PIEZOELECTRIC ACTUATION

Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a piezoelectrically actuated tunable capacitor having a variable capacitance formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. A piezoelectric actuator of the tunable capacitor includes first and second conductive electrodes and a piezoelectric layer that is positioned between the first and second conductive electrodes.

MICROELECTRONIC DEVICES DESIGNED WITH PACKAGE INTEGRATED VARIABLE CAPACITORS HAVING PIEZOELECTRIC ACTUATION

Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a piezoelectrically actuated tunable capacitor having a variable capacitance formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. A piezoelectric actuator of the tunable capacitor includes first and second conductive electrodes and a piezoelectric layer that is positioned between the first and second conductive electrodes.

VARIABLE VACUUM CAPACITOR AND COOLING METHOD

A variable vacuum capacitor is described in which oil inside the main bellows (21) is pumped through the bellows and through the oil circuit (8) of a heat exchanger by a pump (15). Water passes through coolant channels (6) of the heat exchanger, from inlet (7) to outlet (7). The extendable capacitor drive shaft (14) is hollow and serves as a conduit, conveying the oil to the bottom of the (bellows 21), thereby ensuring a full circulation of the oil right through the bellows and then through the heat exchanger. Pump drive means (9) may be a gerotor hydraulic motor, coupled to a gerotor oil pump (15) via magnetic coupling (22). Pumping heat transfer fluid (oil) through the bellows allows the capacitor to operate at significantly higher currents and/or lower temperatures, and significantly extends the life of the device.

VARIABLE VACUUM CAPACITOR AND COOLING METHOD

A variable vacuum capacitor is described in which oil inside the main bellows (21) is pumped through the bellows and through the oil circuit (8) of a heat exchanger by a pump (15). Water passes through coolant channels (6) of the heat exchanger, from inlet (7) to outlet (7). The extendable capacitor drive shaft (14) is hollow and serves as a conduit, conveying the oil to the bottom of the (bellows 21), thereby ensuring a full circulation of the oil right through the bellows and then through the heat exchanger. Pump drive means (9) may be a gerotor hydraulic motor, coupled to a gerotor oil pump (15) via magnetic coupling (22). Pumping heat transfer fluid (oil) through the bellows allows the capacitor to operate at significantly higher currents and/or lower temperatures, and significantly extends the life of the device.

Power conditioning and saving device
10566600 · 2020-02-18 · ·

Systems and methods are disclosed herein to a power factor adjustor comprising: a power factor measurement unit configured to measure the power factor on an input line to a load and generate a power factor correction signal based on the measured power factor; and a power factor adjustment unit connected to the power factor measurement unit comprising: a fixed capacitor connected in series to a first switching device; and an adjustable element having a variable capacitance connected in parallel to the fixed capacitor and in series to a second switching device, wherein the overall capacitance of the power factor adjustment unit is adjusted by adjusting the capacitance of the adjustable element or by toggling the first and second switching devices in response to the power factor correction signal.

COAXIAL VARIABLE CAPACITOR

A variable capacitor includes first and second movable capacitor plate assemblies disposed in the interior of an enclosure and include a first and second movable capacitor plates. A first fixed capacitor plate and a second fixed capacitor plate are respectively disposed proximal to the first and second movable capacitor plates. The capacitor plates may comprise variably interdigitated concentric cylindrical blades, The first movable capacitor plate and the first fixed capacitor plate may be coaxial with the second movable capacitor plate and the second fixed capacitor plate. Actuators may be provided for independently advancing and retracting the first and second movable capacitor plate assemblies with respect to the first and second fixed capacitor plate assemblies to vary the capacitance of the variable capacitor by independently adjusting an amount of interdigitization of the capacitor plates of respective capacitor plate assembly pairs.

Electrodes for linear switched capacitive devices

A switched capacitive device includes a stationary portion including a plurality of first electrodes extending at least partially in a longitudinal dimension. Each first electrode has a first substantially active electrode volume. The device also includes a translatable portion including a plurality of second electrodes proximate the plurality of first electrodes. Each second electrode has a second substantially active electrode volume. The first active electrode volume is greater than the second active electrode volume. The second electrodes are translatable with respect to the first electrodes. The second electrodes extend at least partially in the longitudinal dimension. The first electrodes are configured to induce substantially linear motion of the second electrodes in the longitudinal dimension through the use of an electric field induced by at least a portion of the first electrodes.

Electrodes for linear switched capacitive devices

A switched capacitive device includes a stationary portion including a plurality of first electrodes extending at least partially in a longitudinal dimension. Each first electrode has a first substantially active electrode volume. The device also includes a translatable portion including a plurality of second electrodes proximate the plurality of first electrodes. Each second electrode has a second substantially active electrode volume. The first active electrode volume is greater than the second active electrode volume. The second electrodes are translatable with respect to the first electrodes. The second electrodes extend at least partially in the longitudinal dimension. The first electrodes are configured to induce substantially linear motion of the second electrodes in the longitudinal dimension through the use of an electric field induced by at least a portion of the first electrodes.

Plasma processing apparatus
11955314 · 2024-04-09 · ·

An apparatus for plasma processing includes a chamber, a substrate support having a lower electrode and an electrostatic chuck disposed on the lower electrode and configured to support a substrate mounted on the electrostatic chuck in the chamber, and a radio frequency power supply configured to supply a radio frequency power to generate plasma in the chamber. Further, in the apparatus, a bias power supply supplies a bias power. A first electrical path electrically connects the bias power supply and the lower electrode, and a second electrical path that is different from the first electrical path and the lower electrode is configured to supply the bias power from the lower electrode or the first electrical path to an edge ring disposed to surround an edge of the substrate. Further, an impedance adjuster provides a variable impedance to the second electrical path.