A capacitor may include a stack assembly. The stack assembly may include a plurality of anode plate members, each having an embedded wire. The anode plate members may be separated by at least one cathode foil sandwiched between separator sheets. A conducting member may electrically connect the embedded wires and may have an externally accessible end portion that is hermetically sealed from the interior of the capacitor. A case covers the stack assembly and may be attached to a cover. The case and cover may enclose the stack assembly within an interior area of the capacitor. The at least one cathode foil may be connected to the case. An electrolyte fluid may be disposed within the interior area of the capacitor. A passage may be provided through a central portion of the stack assembly. A tube, surrounded by insulation, may pass through the passage and may be connected to the cover and the case.

A capacitor may include a stack assembly. The stack assembly may include a plurality of anode plate members, each having an embedded wire. The anode plate members may be separated by at least one cathode foil sandwiched between separator sheets. A conducting member may electrically connect the embedded wires and may have an externally accessible end portion that is hermetically sealed from the interior of the capacitor. A case covers the stack assembly and may be attached to a cover. The case and cover may enclose the stack assembly within an interior area of the capacitor. The at least one cathode foil may be connected to the case. An electrolyte fluid may be disposed within the interior area of the capacitor. A passage may be provided through a central portion of the stack assembly. A tube, surrounded by insulation, may pass through the passage and may be connected to the cover and the case.

Provided is an electrolytic capacitor including: a capacitor element including an anode body, a dielectric layer formed on the anode body, a solid electrolyte layer formed on the dielectric layer, and a cathode layer formed on the solid electrolyte layer; lead terminals each connected to the anode body and the cathode layer; and a packaging member covering at least part of the capacitor element. The packaging member includes a side wall that is electrically conductive, and a bottom face, with at least one of the lead terminals partially exposed from the bottom face. An insulating member is interposed between a first end of the side wall and the lead terminal exposed from the bottom face, the first end being near the bottom face.

Provided is an electrolytic capacitor including: a capacitor element including an anode body, a dielectric layer formed on the anode body, a solid electrolyte layer formed on the dielectric layer, and a cathode layer formed on the solid electrolyte layer; lead terminals each connected to the anode body and the cathode layer; and a packaging member covering at least part of the capacitor element. The packaging member includes a side wall that is electrically conductive, and a bottom face, with at least one of the lead terminals partially exposed from the bottom face. An insulating member is interposed between a first end of the side wall and the lead terminal exposed from the bottom face, the first end being near the bottom face.

A capacitor includes a capacitor element, a bus bar, a case, and a terminal mount. The bus bar includes an electrode terminal connected to an electrode of the capacitor element and a connection terminal configured to be connected to an external terminal. The case houses the capacitor element connected to the bus bar. The terminal mount is disposed closer to an opening of the case than the capacitor element is. The terminal mount is configured to allow the external terminal and the connection terminal to be fixed to the terminal mount. The terminal mount includes a positioning part that positions the terminal mount with respect to the case in a first direction, which is parallel to an opening face of the opening.

An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections.

An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections.

A solid electrolytic capacitor that includes a capacitor element laminate, a first external electrode, and a second external electrode. The capacitor element laminate includes capacitor elements, cathode lead-out layers, and a sealing body. At least one of the capacitor elements includes an anode foil, dielectric layers, and cathode layers. The first external electrode is connected to the anode foil exposed at the first end surface of the capacitor element laminate. The second external electrode is connected to the cathode lead-out layers exposed at the second end surface of the capacitor element laminate. The sealing body includes a first resin molded body and a second resin molded body. The first resin molded body and the second resin molded body are made of the same insulating material.

A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.