This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb-shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates.

This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb-shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates.

A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.

A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.

This method for producing porous sintered aluminum includes: mixing aluminum powder with a sintering aid powder containing titanium to obtain a raw aluminum mixed powder; mixing the raw aluminum mixed powder with a water-soluble resin binder, water, and a plasticizer containing at least one selected from polyhydric alcohols, ethers, and esters to obtain a viscous composition; drying the viscous composition in a state where air bubbles are mixed therein to obtain a formed object prior to sintering; and heating the formed object prior to sintering in a non-oxidizing atmosphere, wherein when a temperature at which the raw aluminum mixed powder starts to melt is expressed as Tm (° C.), a temperature T (° C.) of the heating fulfills Tm−10 (° C.)≤T≤685 (° C.).

A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that a portion of the lead frame is exposed.

An energy storage capacitor having a composite electrode structure includes: a case; a rolled body arranged inside the case; and an electrolyte stored inside the case. The rolled body includes: a first anode foil having a first anode lead plate connected at one side of one surface, a first cathode foil arranged to face the other surface of the first cathode foil with the one surface of the first anode foil and a first cathode lead plate connected at the other side, a second cathode foil arranged to face the other surface of the second cathode foil with one surface of the first cathode foil and having a second cathode lead plate connected at one side of one surface, a second anode foil arranged to face the one surface of the second cathode foil and a second anode lead plate connected at the other side.

An energy storage capacitor having a composite electrode structure includes: a case; a rolled body arranged inside the case; and an electrolyte stored inside the case. The rolled body includes: a first anode foil having a first anode lead plate connected at one side of one surface, a first cathode foil arranged to face the other surface of the first cathode foil with the one surface of the first anode foil and a first cathode lead plate connected at the other side, a second cathode foil arranged to face the other surface of the second cathode foil with one surface of the first cathode foil and having a second cathode lead plate connected at one side of one surface, a second anode foil arranged to face the one surface of the second cathode foil and a second anode lead plate connected at the other side.

A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.