Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.

Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and cavity disposed in the substrate. The cavity extends between the first major surface and a recessed surface. Tantalum material is disposed within the cavity. Further, the tantalum material includes tantalum particles. The electrical component also includes a dielectric layer disposed on the tantalum particles and an electrolyte cathode layer disposed on the dielectric layer. The electrical component further includes a cathode electrode disposed on the electrolyte cathode layer and over the cavity.

The present disclosure relates to a composition that includes a first layer that includes a perovskite defined by ABX.sub.3 and a second layer that includes a perovskite-like material defined by at least one of A′.sub.2B′X′.sub.4, A′.sub.3B′.sub.2X′.sub.9, A′B′X′.sub.4, A′.sub.2B′X′.sub.6, and/or A′.sub.2AB′.sub.2X′.sub.7, where the first layer is adjacent to the second layer, A is a first cation, B is a second cation, X is a first anion, A′ is a third cation, B′ is a fourth cation, X′ is a second anion, and A′ is different than A.

An improved capacitor is provided. The capacitor comprises an anode and a functional dielectric on said anode and a conductive layer on the functional dielectric. An anode wire extends from said anode wherein the anode wire has a thickened dielectric layer thereon.

An improved capacitor is provided. The capacitor comprises an anode and a functional dielectric on said anode and a conductive layer on the functional dielectric. An anode wire extends from said anode wherein the anode wire has a thickened dielectric layer thereon.

A module containing a plurality of active capacitors and a sacrificial capacitor is provided. The active capacitors and sacrificial capacitor are aligned along a horizontal direction so that the side surfaces of their cases are parallel to each other. The particular arrangement of the active capacitors and sacrificial capacitor results in a module configuration where the anode terminations for the active capacitors and an external component of the lead frame for the sacrificial capacitor are coplanar so that the module can be mounted to a circuit board via the anode terminations and the external component of the lead frame in a mechanically and electrically stable manner. Further, the center of gravity of the module in the length and/or width directions can be located at a midpoint of the overall module length and/or width, which enhances the stability of the module when mounted to a circuit board.

A module containing a plurality of active capacitors and a sacrificial capacitor is provided. The active capacitors and sacrificial capacitor are aligned along a horizontal direction so that the side surfaces of their cases are parallel to each other. The particular arrangement of the active capacitors and sacrificial capacitor results in a module configuration where the anode terminations for the active capacitors and an external component of the lead frame for the sacrificial capacitor are coplanar so that the module can be mounted to a circuit board via the anode terminations and the external component of the lead frame in a mechanically and electrically stable manner. Further, the center of gravity of the module in the length and/or width directions can be located at a midpoint of the overall module length and/or width, which enhances the stability of the module when mounted to a circuit board.

The invention relates to a method for producing electrode foils (1) for capacitors (10), comprising the method steps of: A) providing a metal foil (1), B) transferring microstructures (2) located on a stamping die onto a main surface of the metal foil by a reforming process.

A capacitor element sequentially including a dielectric layer containing an amorphous tungsten oxide, a layer coating a part or all of the dielectric layer and containing a crystalline tungsten oxide, a semiconductor layer and a conductor layer on a tungsten-containing anode body. The capacitor element is manufactured by a method including a sintering step of forming an anode body by sintering a formed body of a tungsten powder; a step of forming a dielectric layer by subjecting the anode body to a chemical conversion treatment; a step of forming a crystalline tungsten oxide layer on the dielectric layer; a step of forming a semiconductor layer for forming a semiconductor layer; and a step of forming a conductor layer for forming a conductor layer; in this order.

A capacitor element sequentially including a dielectric layer containing an amorphous tungsten oxide, a layer coating a part or all of the dielectric layer and containing a crystalline tungsten oxide, a semiconductor layer and a conductor layer on a tungsten-containing anode body. The capacitor element is manufactured by a method including a sintering step of forming an anode body by sintering a formed body of a tungsten powder; a step of forming a dielectric layer by subjecting the anode body to a chemical conversion treatment; a step of forming a crystalline tungsten oxide layer on the dielectric layer; a step of forming a semiconductor layer for forming a semiconductor layer; and a step of forming a conductor layer for forming a conductor layer; in this order.